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Journal Articles

Thermal Transport in Polymers: A Review

Xingfei Wei, Zhi Wang, Zhiting Tian, Tengfei Luo
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. July 2021, 143(7): 072101.
Paper No: HT-20-1612
https://doi.org/10.1115/1.4050557
Published Online: April 22, 2021
View Article titled, Thermal Transport in Polymers: A Review
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Topics: Chain, Polymer fibers, Polymers, Thermal conductivity, Temperature
Journal Articles

Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Nazli Donmezer, Ashutosh Giri, Patrick E. Hopkins, Sukwon Choi, Darshan Pahinkar, Jingjing Shi, Samuel Graham, Zhiting Tian, Laura Ruppalt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020804.
Paper No: EP-20-1070
https://doi.org/10.1115/1.4049293
Published Online: February 22, 2021
View Article titled, Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
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Topics: Electronics, Gallium nitride, Heat, Nanoscale phenomena, Phonons, Temperature, Thermal conductivity, Electromagnetic scattering, Energy gap, Diamonds
Journal Articles

Heat Transfer in Thermoelectric Materials and Devices

Zhiting Tian, Sangyeop Lee, Gang Chen
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. June 2013, 135(6): 061605.
Paper No: HT-12-1576
https://doi.org/10.1115/1.4023585
Published Online: May 16, 2013
View Article titled, Heat Transfer in Thermoelectric Materials and Devices
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Topics: Phonons, Thermal conductivity, Electromagnetic scattering, Heat transfer, Heat conduction
Proceedings Papers

A Molecular Dynamics Study of Thermal Conductivity in Nanocomposites via the Phonon Wave Packet Method

Zhiting Tian, Sang Kim, Ying Sun, Bruce White
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 607-615, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89272
https://doi.org/10.1115/InterPACK2009-89272
View Paper titled, A Molecular Dynamics Study of Thermal Conductivity in Nanocomposites via the Phonon Wave Packet Method
Open the PDF for A Molecular Dynamics Study of Thermal Conductivity in Nanocomposites via the Phonon Wave Packet Method in another window
Topics: Molecular dynamics, Nanocomposites, Phonons, Thermal conductivity, Wave packets, Molecular dynamics simulation, Electromagnetic scattering, Equilibrium (Physics), Flow (Dynamics), Heat