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Proceedings Papers

Numerical Simulation for Effect of Rolling Motion on Thermal Stratification in a Surge Line

Y. L. Shen, Tao Lu, Bo Liu
Proc. ASME. ICONE25, Volume 8: Computational Fluid Dynamics (CFD) and Coupled Codes; Nuclear Education, Public Acceptance and Related Issues, V008T09A033, July 2–6, 2017
Publisher: American Society of Mechanical Engineers
Paper No: ICONE25-67026
https://doi.org/10.1115/ICONE25-67026
View Paper titled, Numerical Simulation for Effect of Rolling Motion on Thermal Stratification in a Surge Line
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Topics: Computer simulation, Surges, Thermal stratification, Temperature, Computational fluid dynamics, Fluids, Pipes, Temperature distribution, Degrees of freedom, Fatigue
Journal Articles

Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip Stack

R. W. Johnson, Y.-L. Shen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021011.
Paper No: EP-14-1045
https://doi.org/10.1115/1.4029345
Published Online: June 1, 2015
View Article titled, Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip Stack
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Topics: Electron mobility, Solders, Stress, Thermal stresses, Intermetallic compounds, Deformation
Proceedings Papers

Analysis of Plastic Deformation in Metal-Ceramic Nanolayers During Cyclic Indentation

C. B. Blada, Y.-L. Shen
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 863-872, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-87751
https://doi.org/10.1115/IMECE2012-87751
View Paper titled, Analysis of Plastic Deformation in Metal-Ceramic Nanolayers During Cyclic Indentation
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Topics: Ceramics, Deformation, Metals, Cycles, Silicon, Stress, Aluminum, Computer simulation, Diamonds, Displacement
Proceedings Papers

Analysis of TSV/Micro-Bump Deformation due to Chip Misalignment and Thermal Processing in 3D IC Packages

R. W. Johnson, Y.-L. Shen
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1001-1010, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-87728
https://doi.org/10.1115/IMECE2012-87728
View Paper titled, Analysis of TSV/Micro-Bump Deformation due to Chip Misalignment and Thermal Processing in 3D IC Packages
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Topics: Deformation, Shear deformation, Bonding, Silicon chips, Solders, Stress, Thermal expansion, Damage, Finite element model, Integrated circuits
Proceedings Papers

Indentation Mechanics for Micro- and Nano-Layered Composites

G. Tang, Y.-L. Shen
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 289-294, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70038
https://doi.org/10.1115/MicroNano2008-70038
View Paper titled, Indentation Mechanics for Micro- and Nano-Layered Composites
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Topics: Composite materials, Deformation, Silicon, Tension, Aluminum, Ceramics, Computer simulation, Cracking (Materials), Diamonds, Finite element methods
Proceedings Papers

Modeling of Thermo-Mechanical Stresses in Copper Interconnect/Low-k Dielectric Systems

Y.-L. Shen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1323-1330, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73450
https://doi.org/10.1115/IPACK2005-73450
View Paper titled, Modeling of Thermo-Mechanical Stresses in Copper Interconnect/Low-k Dielectric Systems
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Topics: Copper, Modeling, Stress, Thermomechanics, Dielectric materials, Deformation, Electrodiffusion, Failure, Finite element analysis, Fracture (Materials)
Journal Articles

Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer

M. A. Neidigk, Y.-L. Shen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011003.
https://doi.org/10.1115/1.3068298
Published Online: February 11, 2009
View Article titled, Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer
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Topics: Ceramics, Coating processes, Coatings, Computer simulation, Cooling, Epoxy resins, Failure, Ferrites (Magnetic materials), Finite element analysis, Manufacturing
Proceedings Papers

Deformation and Damage in Solder During Fast Cyclic Loading

E. S. Ege, Y.-L. Shen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 101-107, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35030
https://doi.org/10.1115/IPACK2003-35030
View Paper titled, Deformation and Damage in Solder During Fast Cyclic Loading
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Topics: Damage, Deformation, Solders, Intermetallic compounds, Shear (Mechanics), Failure, Modeling, Alloys, Cracking (Materials), Fatigue
Proceedings Papers

Effects of Grain Boundary Sliding on Microstructural Evolution and Damage Accumulation in Tin-Lead Alloy

Y.-L. Shen, K. C. R. Abell, S. E. Garrett
Proc. ASME. IMECE2002, Applied Mechanics and Biomedical Technology, 71-78, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-32885
https://doi.org/10.1115/IMECE2002-32885
View Paper titled, Effects of Grain Boundary Sliding on Microstructural Evolution and Damage Accumulation in Tin-Lead Alloy
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Topics: Alloys, Damage, Grain boundaries, Solder joints, Deformation, Diffusion (Physics), Compression, Fatigue damage, Mechanical properties, Microelectronic packaging
Proceedings Papers

Analysis of Indentation-Derived Yield Strength in Metallic Multilayers

X. H. Tan, Y.-L. Shen
Proc. ASME. IMECE2004, Materials, 117-122, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-61393
https://doi.org/10.1115/IMECE2004-61393
View Paper titled, Analysis of Indentation-Derived Yield Strength in Metallic Multilayers
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Topics: Yield strength, Composite materials, Mechanical properties, Finite element analysis, Flow (Dynamics), Friction, Modeling, Nanoindentation, Plastics, Probes
Proceedings Papers

Characterization of Indentation-Induced “Particle Crowding” in Metal Matrix Composites

R. Pereyra, Y.-L. Shen
Proc. ASME. IMECE2004, Materials, 71-77, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-60560
https://doi.org/10.1115/IMECE2004-60560
View Paper titled, Characterization of Indentation-Induced “Particle Crowding” in Metal Matrix Composites
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Topics: Metal matrix composites, Particulate matter, Composite materials, Compressive stress, Cross section (Physics), Experimental characterization, Finite element analysis, Metallography
Journal Articles

Phase Structure and Cyclic Deformation in Eutectic Tin-Lead Alloy: A Numerical Analysis

Y.-L. Shen, W. Li, H. E. Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 74–78.
https://doi.org/10.1115/1.1324673
Published Online: June 29, 2000
View Article titled, Phase Structure and Cyclic Deformation in Eutectic Tin-Lead Alloy: A Numerical Analysis
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Topics: Alloys, Deformation, Shear (Mechanics), Stress, Fatigue, Tin, Damage, Eutectic alloys, Cycles, Modeling