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Y. H. Hung
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Proceedings Papers
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 27-34, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24374
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 909-916, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33277
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 917-924, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33278
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 205-212, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33281
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 213-220, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33285
Proceedings Papers
Proc. ASME. HT2005, Heat Transfer: Volume 4, 687-694, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72225
Proceedings Papers
Proc. ASME. HT2005, Heat Transfer: Volume 4, 591-598, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72157
Proceedings Papers
Proc. ASME. HT2005, Heat Transfer: Volume 4, 519-526, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72234
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 161-168, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73120
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 143-150, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73118
Proceedings Papers
Forced Convective Heat Transfer for Partially-Confined Compact PPF Heat Sinks With Top-Bypass Effect
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 169-176, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73121
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 73-80, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35020
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 63-71, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35018
Proceedings Papers
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 15-22, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-59485
Proceedings Papers
Proc. ASME. IMECE2004, Heat Transfer, Volume 2, 281-288, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-59668
Proceedings Papers
Proc. ASME. IMECE2004, Heat Transfer, Volume 2, 241-248, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-61442
Proceedings Papers
Proc. ASME. IMECE2005, Fluids Engineering, 531-538, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-80028
Proceedings Papers
Proc. ASME. IMECE2005, Fluids Engineering, 893-900, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-80168
Proceedings Papers
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 481-488, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-80011
Proceedings Papers
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 517-524, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-81066
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