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Proceedings Papers

Heat Partitioning and Temperatures in Grinding

Y. Ju, T. N. Farris, S. Chandrasekar
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 259-266, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0793
https://doi.org/10.1115/IMECE1996-0793
View Paper titled, Heat Partitioning and Temperatures in Grinding
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Topics: Grinding, Heat, Temperature, Fluids, Steel, Aluminum, Creep, Damage, Heat flux, Theoretical analysis
Proceedings Papers

Effect of High Density Electric Current Field on Fatigue Cracks in Stainless Steel

A. Hosoi, T. Nagahama, Y. Ju
Proc. ASME. IMECE2010, Volume 9: Mechanics of Solids, Structures and Fluids, 123-128, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-37819
https://doi.org/10.1115/IMECE2010-37819
View Paper titled, Effect of High Density Electric Current Field on Fatigue Cracks in Stainless Steel
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Topics: Density, Electric current, Fatigue cracks, Stainless steel, Fracture (Materials), Displacement, Bridges (Structures), Electrodes
Proceedings Papers

Micro- and Nanoscale Phonon Heat Transport in Silicon

Y. Ju
Proc. ASME. HT-FED2004, Volume 4, 631-638, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56743
https://doi.org/10.1115/HT-FED2004-56743
View Paper titled, Micro- and Nanoscale Phonon Heat Transport in Silicon
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Topics: Heat, Nanoelectronics, Nanoscale phenomena, Nanowires, Phonons, Semiconductors (Materials), Silicon
Journal Articles

Microwave Imaging for the Integrity Assessment of IC Packages

Y. Ju, M. Saka, H. Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 42–46.
https://doi.org/10.1115/1.1326440
Published Online: July 18, 2000
View Article titled, Microwave Imaging for the Integrity Assessment of IC Packages
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Topics: Delamination, Imaging, Microwaves, Sensors, Inspection, Reliability, Resolution (Optics), Dimensions, Shapes
Journal Articles

Theoretical Analysis of Heat Partition and Temperatures in Grinding

Y. Ju, T. N. Farris, S. Chandrasekar
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. October 1998, 120(4): 789–794.
https://doi.org/10.1115/1.2833780
Published Online: October 1, 1998
View Article titled, Theoretical Analysis of Heat Partition and Temperatures in Grinding
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Topics: Grinding, Heat, Temperature, Theoretical analysis, Aluminum, Fluids, Steel, Wheels, Boiling, Creep
Journal Articles

FFT Thermoelastic Solutions for Moving Heat Sources

Y. Ju, T. N. Farris
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. January 1997, 119(1): 156–162.
https://doi.org/10.1115/1.2832452
Published Online: January 1, 1997
View Article titled, FFT Thermoelastic Solutions for Moving Heat Sources
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Topics: Heat, Thermoelasticity, Displacement, Elastic half space, Fourier transforms, Low-pass filters, Shear stress, Traction
Journal Articles

Spectral Analysis of Two-Dimensional Contact Problems

Y. Ju, T. N. Farris
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. April 1996, 118(2): 320–328.
https://doi.org/10.1115/1.2831303
Published Online: April 1, 1996
View Article titled, Spectral Analysis of Two-Dimensional Contact Problems
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Topics: Contact mechanics, Emission spectroscopy, Spectroscopy, Pressure, Displacement, Algebra, Surface roughness, Fast Fourier transforms