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1-7 of 7
Weijie Wang
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Journal Articles
Yiwen Song, James Spencer Lundh, Weijie Wang, Jacob H. Leach, Devon Eichfeld, Anusha Krishnan, Carlos Perez, Dong Ji, Trent Borman, Kevin Ferri, Jon-Paul Maria, Srabanti Chowdhury, Jae-Hyun Ryou, Brian M. Foley, Sukwon Choi
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041112.
Paper No: EP-20-1014
Published Online: July 10, 2020
Proceedings Papers
Proc. ASME. GT2019, Volume 5A: Heat Transfer, V05AT13A005, June 17–21, 2019
Publisher: American Society of Mechanical Engineers
Paper No: GT2019-90849
Proceedings Papers
Proc. ASME. IMECE2017, Volume 13: Acoustics, Vibration and Phononics, V013T01A010, November 3–9, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2017-70293
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. September 2015, 137(9): 091022.
Paper No: HT-14-1288
Published Online: September 1, 2015
Proceedings Papers
Proc. ASME. MNHMT2013, ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T05A004, December 11–14, 2013
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2013-22107
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. September 2013, 135(9): 091504.
Paper No: HT-12-1342
Published Online: July 26, 2013
Proceedings Papers
Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 475-481, March 3–6, 2012
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2012-75139