1-4 of 4
W. D. van Driel
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Reliability of Electronic Drivers: An Industrial Approach

P. Watté, G. van Hees, R. Engelen, W. D. van Driel
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A005, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72293
https://doi.org/10.1115/IPACK2021-72293
View Paper titled, Reliability of Electronic Drivers: An Industrial Approach
Open the PDF for Reliability of Electronic Drivers: An Industrial Approach in another window
Topics: Reliability
Journal Articles

Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements

J. J. M. Zaal, W. D. van Driel, F. J. H. G. Kessels, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011007.
https://doi.org/10.1115/1.3068311
Published Online: February 12, 2009
View Article titled, Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements
Open the PDF for Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements in another window
Topics: Impact testing, Reliability, Simulation, Solders, Testing, Deflection, Damping
Journal Articles

Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound

W. D. van Driel, J. H. J. Janssen, G. Q. Zhang, D. G. Yang, L. J. Ernst
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 520–526.
https://doi.org/10.1115/1.1604153
Published Online: December 15, 2003
View Article titled, Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound
Open the PDF for Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound in another window
Topics: Anisotropy, Molding, Packaging, Stress, Temperature, Viscoelasticity, Finite element analysis
Journal Articles

Response Surface Modeling for Nonlinear Packaging Stresses

W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, L. J. Ernst
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 490–497.
https://doi.org/10.1115/1.1604149
Published Online: December 15, 2003
View Article titled, Response Surface Modeling for Nonlinear Packaging Stresses
Open the PDF for Response Surface Modeling for Nonlinear Packaging Stresses in another window
Topics: Design, Finite element model, Packaging, Response surface methodology, Stress, Temperature, Optimization, Modeling, Solders, Testing