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Victor Adrian Chiriac
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Proceedings Papers

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

Victor Adrian Chiriac, Tien -Yu Tom Lee
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 93-100, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24382
https://doi.org/10.1115/IMECE2001/HTD-24382
View Paper titled, Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance
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Topics: Design, Gallium arsenide, Temperature, Thermal conductivity, Metals, Computer simulation, Junctions, Microelectronic devices, Packaging, Reliability
Proceedings Papers

A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets

Victor Adrian Chiriac, Tien -Yu Tom Lee, Jorge Luis Rosales
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 81-89, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24381
https://doi.org/10.1115/IMECE2001/HTD-24381
View Paper titled, A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets
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Topics: Air jets, Cooling, Microelectronic devices, Heat transfer, Channel flow, Flow (Dynamics), High temperature, Reynolds number, Buckling, Engineering simulation
Proceedings Papers

Thermal Design Analysis of Free Space Optical Interconnect (FSOI) Package Module

Victor Adrian Chiriac, Tien-Yu Tom Lee
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 163-170, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24389
https://doi.org/10.1115/IMECE2001/HTD-24389
View Paper titled, Thermal Design Analysis of Free Space Optical Interconnect (FSOI) Package Module
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Topics: Design, Optical interconnections, Vacuum, Temperature, Ceramics, Lumber, Copper, Manufacturing, Cavities, Computer software
Proceedings Papers

Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process

Victor Adrian Chiriac, Tien-Yu Tom Lee
Proc. ASME. IMECE2000, Manufacturing Engineering, 453-459, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1840
https://doi.org/10.1115/IMECE2000-1840
View Paper titled, Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process
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Topics: Anisotropy, Manufacturing, Thermal analysis, Transients (Dynamics), Temperature, Computational fluid dynamics, Hardening (Curing), Convection, Cooling, Heat conduction
Proceedings Papers

The Microelectronics Cooling Impact and Comparison of 2D and 3D Unsteady Effects of a Pair of Opposed Confined Angled Impinging Air Jets

Victor Adrian Chiriac, Jorge Luis Rosales
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 357-365, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52262
https://doi.org/10.1115/IPACK2011-52262
View Paper titled, The Microelectronics Cooling Impact and Comparison of 2D and 3D Unsteady Effects of a Pair of Opposed Confined Angled Impinging Air Jets
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Topics: Air jets, Cooling, Jets, Microelectronic devices
Proceedings Papers

Advanced Cooling With Embedded Heat Pipes for High Power Microelectronics

Victor Adrian Chiriac
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 769-776, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89111
https://doi.org/10.1115/InterPACK2009-89111
View Paper titled, Advanced Cooling With Embedded Heat Pipes for High Power Microelectronics
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Topics: Cooling, Fans, Heat pipes, Heat sinks, Microelectronic devices
Proceedings Papers

A Numerical Comparison of 2D and 3D Unsteady Confined Impinging Air Jets and Associated Microelectronics Cooling Impact

Victor Adrian Chiriac, Jorge Luis Rosales
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 811-818, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33708
https://doi.org/10.1115/IPACK2007-33708
View Paper titled, A Numerical Comparison of 2D and 3D Unsteady Confined Impinging Air Jets and Associated Microelectronics Cooling Impact
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Topics: Air jets, Buckling, Cooling, Dimensions, Engineering simulation, Flow (Dynamics), Heat, Heat transfer, Jets, Microelectronic devices
Proceedings Papers

A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication

Youmin Yu, Victor Adrian Chiriac, Tien-Yu Tom Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 783-790, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33335
https://doi.org/10.1115/IPACK2007-33335
View Paper titled, A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication
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Topics: Capacitors, Resistors, Telecommunications, Transients (Dynamics), Temperature, Cycles, Heat, Topology, Curve fitting, Simulation
Proceedings Papers

System-Level Transient Thermal Analysis for Performance Optimization of High Power Microelectronics

Victor Adrian Chiriac, Tien-Yu Tom Lee, H. S. Chen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 435-442, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35213
https://doi.org/10.1115/IPACK2003-35213
View Paper titled, System-Level Transient Thermal Analysis for Performance Optimization of High Power Microelectronics
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Topics: Microelectronic devices, Optimization, Thermal analysis, Transients (Dynamics), Temperature, Cycles, Design, Computer software, Cooling, Flow (Dynamics)
Proceedings Papers

System and Package Level Thermal Optimization of Power Amplifier Modules With Application in Wireless Communication

Victor Adrian Chiriac, Tien-Yu Tom Lee, David Lutz
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 443-450, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35216
https://doi.org/10.1115/IPACK2003-35216
View Paper titled, System and Package Level Thermal Optimization of Power Amplifier Modules With Application in Wireless Communication
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Topics: Optimization, Temperature, Elastomers, Design, Slug flows, Computer software, Copper, Failure, High temperature, Numerical analysis
Proceedings Papers

Transient Thermal Investigation for a SmartMOS Based Airbag Circuit Driver

Victor Adrian Chiriac, Tien-Yu Tom Lee, Paul Bennett
Proc. ASME. IMECE2002, Heat Transfer, Volume 5, 181-188, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39531
https://doi.org/10.1115/IMECE2002-39531
View Paper titled, Transient Thermal Investigation for a SmartMOS Based Airbag Circuit Driver
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Topics: Airbags, Circuits, Transients (Dynamics), Temperature, Boundary-value problems, Junctions, Computer software, Energy dissipation, Engineering simulation, Heat
Proceedings Papers

Control of Convective Heat Transfer in a Confined Laminar Impinging Jet by Low Amplitude Forcing

Victor Adrian Chiriac, Alfonso Ortega
Proc. ASME. IMECE2002, Heat Transfer, Volume 1, 31-39, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-32909
https://doi.org/10.1115/IMECE2002-32909
View Paper titled, Control of Convective Heat Transfer in a Confined Laminar Impinging Jet by Low Amplitude Forcing
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Topics: Air jets, Buckling, Convection, Cooling, Excitation, Flow (Dynamics), Heat transfer, Nozzles, Reynolds number, Separation (Technology)
Proceedings Papers

Board-Side Boundary Condition for a Single Component on a PCB in Forced Convection

Sriram Neelakantan, Victor Adrian Chiriac
Proc. ASME. IMECE2002, Heat Transfer, Volume 2, 115-120, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-33731
https://doi.org/10.1115/IMECE2002-33731
View Paper titled, Board-Side Boundary Condition for a Single Component on a PCB in Forced Convection
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Topics: Boundary-value problems, Forced convection, Computational fluid dynamics, Junctions, Simulation, Temperature, Computational methods, Heat transfer coefficients, Air flow, Copper
Proceedings Papers

Thermal Assessment of a Power Amplifier Module in Wireless Handsets

Victor Adrian Chiriac, Tien-Yu Tom Lee
Proc. ASME. IMECE2002, Heat Transfer, Volume 5, 161-168, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39179
https://doi.org/10.1115/IMECE2002-39179
View Paper titled, Thermal Assessment of a Power Amplifier Module in Wireless Handsets
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Topics: Computer simulation, Computer software, Copper, Design, Errors, Heat, Heat sinks, Numerical analysis, Optimization, Packaging
Proceedings Papers

Microelectronic Cooling Techniques Using Single and Dual Oscillatory Impinging Air Jets

Victor Adrian Chiriac, Tien-Yu Tom Lee, Jorge Luis Rosales
Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 171-178, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39243
https://doi.org/10.1115/IMECE2002-39243
View Paper titled, Microelectronic Cooling Techniques Using Single and Dual Oscillatory Impinging Air Jets
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Topics: Air jets, Cooling, Heat transfer, Jets, Flow (Dynamics), Temperature, Flat heat pipes, Heat sinks, Manufacturing, Microelectronic devices
Proceedings Papers

The Unsteady Characteristics of a Laminar Flow and Heat Transfer of a Pair of Confined Impinging Air Jets

Victor Adrian Chiriac, Jorge Luis Rosales
Proc. ASME. IMECE2003, Heat Transfer, Volume 2, 219-225, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42142
https://doi.org/10.1115/IMECE2003-42142
View Paper titled, The Unsteady Characteristics of a Laminar Flow and Heat Transfer of a Pair of Confined Impinging Air Jets
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Topics: Air jets, Heat transfer, Laminar flow, Heat, Flow (Dynamics), Jets, Bubbles, Heat transfer coefficients, Cooling, Dimensions
Proceedings Papers

Thermal Performance Optimization of RF Packages for Wireless Communication

Victor Adrian Chiriac, Tien-Yu Tom Lee, Vern Hause
Proc. ASME. IMECE2003, Heat Transfer, Volume 2, 227-233, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42171
https://doi.org/10.1115/IMECE2003-42171
View Paper titled, Thermal Performance Optimization of RF Packages for Wireless Communication
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Topics: Optimization, Temperature, Junctions, Thermal resistance, Solders, Computer simulation, Design, Electrical conductivity, Epoxy adhesives, Epoxy resins
Proceedings Papers

Transient Thermal Evaluation for Integrated Motor Control System With Multiple Dynamic Heat Sources

Victor Adrian Chiriac, Tien-Yu Lee, David Bien
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 447-453, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42050
https://doi.org/10.1115/IMECE2003-42050
View Paper titled, Transient Thermal Evaluation for Integrated Motor Control System With Multiple Dynamic Heat Sources
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Topics: Heat, Motor controls, Transients (Dynamics), Temperature, Junctions, Motors, Thermal resistance, Approximation, Boundary-value problems, Computer simulation
Proceedings Papers

Thermal Assessment of Cooling System Incorporating Heat Sink and Embedded Heat Pipes for Testing High Power Microelectronics

Victor Adrian Chiriac, Tien-Yu Tom Lee
Proc. ASME. IMECE2005, Heat Transfer, Part A, 767-774, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-81794
https://doi.org/10.1115/IMECE2005-81794
View Paper titled, Thermal Assessment of Cooling System Incorporating Heat Sink and Embedded Heat Pipes for Testing High Power Microelectronics
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Topics: Cooling systems, Fans, Heat pipes, Heat sinks, Microelectronic devices, Testing
Proceedings Papers

System Level Thermal Performance Evaluation of New Inverted Exposed Pad Packages for Automotive Applications

Victor Adrian Chiriac, Tien-Yu Tom Lee
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 207-212, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-14722
https://doi.org/10.1115/IMECE2006-14722
View Paper titled, System Level Thermal Performance Evaluation of New Inverted Exposed Pad Packages for Automotive Applications
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Topics: Automotive industry, Performance evaluation, Junctions, Temperature, Copper alloys, Design, Thermal resistance, Computational fluid dynamics, Epoxy adhesives, Epoxy resins