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Tung Nguyen
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Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A002, July 16–18, 2013
Paper No: IPACK2013-73110
Proceedings Papers

Proc. ASME. ESDA2012, Volume 1: Advanced Computational Mechanics; Advanced Simulation-Based Engineering Sciences; Virtual and Augmented Reality; Applied Solid Mechanics and Material Processing; Dynamical Systems and Control, 519-527, July 2–4, 2012
Paper No: ESDA2012-82777
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 603-608, July 6–8, 2011
Paper No: IPACK2011-52232
Proceedings Papers

Proc. ASME. IDETC-CIE2007, Volume 1: 21st Biennial Conference on Mechanical Vibration and Noise, Parts A, B, and C, 1987-1994, September 4–7, 2007
Paper No: DETC2007-34288