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Proceedings Papers

A Modeling Study of the Effect of Underfill Materials on Solder Joint Thermal Fatigue of Ball Grid Array Package

Wei Wang, Tung Nguyen
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A078, November 14–20, 2014
Paper No: IMECE2014-38889
DOI: https://doi.org/10.1115/IMECE2014-38889
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Topics: Ball-Grid-Array packages, Fatigue, Modeling, Solder joints, Fatigue life, Finite element methods, Solders, Young's modulus, Materials properties, Temperature
Proceedings Papers

Validation of Material Constants for Low-Cycle Fatigue Modeling

Quang Nguyen, Seungbae Park, Tung Nguyen
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A055, November 14–20, 2014
Paper No: IMECE2014-39267
DOI: https://doi.org/10.1115/IMECE2014-39267
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Topics: Low cycle fatigue, Modeling, Computer simulation, Electrical resistance, Failure, Fatigue life, Impact modeling, Lumber, Solder joints, Weibull distribution
Proceedings Papers

Characterization of Crack Growth in BGA Under Drop Impact

Quang Nguyen, Seungbae Park, Tung Nguyen
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A002, July 16–18, 2013
Paper No: IPACK2013-73110
DOI: https://doi.org/10.1115/IPACK2013-73110
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Topics: Ball-Grid-Array packaging, Fracture (Materials), Solder joints, Damage, Imaging, Low cycle fatigue, Microscopes, Polishing, Tin, Vehicles
Proceedings Papers

Some New Theoretical Results for Orthotropic Inflatable Beams

Quang Tung Nguyen, Jean-Christophe Thomas, Anh Le Van
Proc. ASME. ESDA2012, Volume 1: Advanced Computational Mechanics; Advanced Simulation-Based Engineering Sciences; Virtual and Augmented Reality; Applied Solid Mechanics and Material Processing; Dynamical Systems and Control, 519-527, July 2–4, 2012
Paper No: ESDA2012-82777
DOI: https://doi.org/10.1115/ESDA2012-82777
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Topics: Air-supported structures, Deformation, Finite element analysis, Kinematics, Lightweight structures, Membranes, Pressure, Rotation, Stiffness, Stress
Proceedings Papers

Effect of Compressive Loading on the Interconnect Reliability Under Thermal Cycling

Da Yu, Tung Nguyen, Ho H. Lee, Namseo Goo, S. B. Park
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 603-608, July 6–8, 2011
Paper No: IPACK2011-52232
DOI: https://doi.org/10.1115/IPACK2011-52232
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Topics: Reliability, Heat, Heat sinks, Power density, Solder joints, Circuits, Computer simulation, Cycles, Energy dissipation, Experimental methods
Proceedings Papers

Deformation and Strain Measurement of Flip-Chip Solder Bump Under In-Situ Thermal Loading

Jae B. Kwak, Dong Gun Lee, Tung Nguyen, Seungbae Park
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 311-318, November 13–19, 2009
Paper No: IMECE2009-12641
DOI: https://doi.org/10.1115/IMECE2009-12641
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Topics: Deformation, Flip-chip, Solders, Strain measurement, Solder joints, Heating, Thermomechanics, Chemical etching, Corners (Structural elements), Displacement
Proceedings Papers

Characteristics of Ramp Load of Hard Disk Drive With Magnetic Bias and Inertia Latch

Yanning Liu, Sean Kang, Bo Li, Tung Nguyen
Proc. ASME. IDETC-CIE2007, Volume 1: 21st Biennial Conference on Mechanical Vibration and Noise, Parts A, B, and C, 1987-1994, September 4–7, 2007
Paper No: DETC2007-34288
DOI: https://doi.org/10.1115/DETC2007-34288
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Topics: Disks, Inertia (Mechanics), Stress, Horizontal directional drilling, Shock (Mechanics), Design, Computers, Reliability, Actuators, Circuits