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Tommi Reinikainen
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Proceedings Papers

The Effect of Intermetallic Compound in Solder Joint Fatigue Life Prediction Using Finite Element Modeling

Mohammad Masum Hossain, Dereje Agonafer, Puligandla Viswanadham, Tommi Reinikainen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 853-862, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35281
https://doi.org/10.1115/IPACK2003-35281
View Paper titled, The Effect of Intermetallic Compound in Solder Joint Fatigue Life Prediction Using Finite Element Modeling
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Topics: Fatigue life, Finite element analysis, Intermetallic compounds, Modeling, Solder joints, Solders, Temperature, Electronic packages, Failure, Finite element model
Proceedings Papers

Reliability Study of Package Stacking Under Thermomechanical Conditions

Jiansen Zhu, Kazuo Ishibahsi, Tommi Reinikainen
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 93-97, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-81822
https://doi.org/10.1115/IMECE2005-81822
View Paper titled, Reliability Study of Package Stacking Under Thermomechanical Conditions
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Topics: Finite element analysis, Modeling, Printed circuit boards, Reliability, Simulation, Simulation results, Testing, Thermomechanics
Proceedings Papers

Deformation Characteristics and Constitutive Relationship of SnAgCu Lead (Pb)-Free Solder Alloys Under Thermo-Mechanical and Mechanical Loading

Mohammad M. Hossain, Puligandla Viswanadham, Dereje Agonafer, Tommi Reinikainen
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 91-99, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13745
https://doi.org/10.1115/IMECE2006-13745
View Paper titled, Deformation Characteristics and Constitutive Relationship of SnAgCu Lead (Pb)-Free Solder Alloys Under Thermo-Mechanical and Mechanical Loading
Open the PDF for Deformation Characteristics and Constitutive Relationship of SnAgCu Lead (Pb)-Free Solder Alloys Under Thermo-Mechanical and Mechanical Loading in another window
Topics: Alloys, Deformation, Solders, Thermal expansion, Thermomechanics
Journal Articles

Optimal Parameter Selection for Electronic Packaging Using Sequential Computer Simulations

Abhishek Gupta, Yu Ding, Leon Xu, Tommi Reinikainen
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. August 2006, 128(3): 705–715.
https://doi.org/10.1115/1.2193551
Published Online: August 28, 2005
View Article titled, Optimal Parameter Selection for Electronic Packaging Using Sequential Computer Simulations
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Topics: Computer simulation, Design, Electronic packaging, Finite element analysis, Response surface methodology, Simulation, Uncertainty, Stress
Journal Articles

Three- and Four-Point Bend Testing for Electronic Packages

Santosh Shetty, Tommi Reinikainen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 556–561.
https://doi.org/10.1115/1.1604158
Published Online: December 15, 2003
View Article titled, Three- and Four-Point Bend Testing for Electronic Packages
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Topics: Printed circuit boards, Reliability, Simulation, Solder joints, Stress, Testing, Electronic packages, Failure