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T. Shibuya
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eBook Chapter

Dynamic Force Calibration for Measuring Impact Fracture Toughness using the Charpy Testing Machine

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 2000
https://doi.org/10.1520/STP14399S
ISBN-10: 0-8031-2864-9
ISBN: 978-0-8031-2864-4
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eBook Chapter

Mixed-Mode Fracture Behavior of Silica Particulate Filled Epoxide Resin

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1999
https://doi.org/10.1520/STP14247S
ISBN-10: 0-8031-2602-6
ISBN: 978-0-8031-2602-2
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Journal Articles

Fatigue Life Estimation of Solder Joints in SMT-PGA Packages

M. Mukai, T. Kawakami, Y. Hiruta, K. Takahashi, K. Kishimoto, T. Shibuya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1998, 120(2): 207–212.
https://doi.org/10.1115/1.2792623
Published Online: June 1, 1998
View Article titled, Fatigue Life Estimation of Solder Joints in SMT-PGA Packages
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Topics: Fatigue life, Solder joints, Constitutive equations, Creep, Solders, Cycles, Electronic components, Failure, Stress analysis (Engineering), Surface mount technology