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Suresh K. Sitaraman
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Proceedings Papers

A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface

David Samet, Abhishek Kwatra, Suresh K. Sitaraman
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48447
https://doi.org/10.1115/IPACK2015-48447
View Paper titled, A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface
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Topics: Copper, Epoxy adhesives, Epoxy resins, Fatigue cracks, Fracture (Materials), Crack propagation, Fatigue, Cycles, Design, Displacement
Proceedings Papers

Fabrication of Second-Level TriDelta Interconnects Using Negative Dry-Film Photoresist

Wei Chen, Yaqin Song, Jiaxing Liang, Suresh K. Sitaraman
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A041, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-40154
https://doi.org/10.1115/IMECE2014-40154
View Paper titled, Fabrication of Second-Level TriDelta Interconnects Using Negative Dry-Film Photoresist
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Topics: Manufacturing, Photoresists, Design, Semiconductor wafers, Silicon, Displacement, Liquid films, Stress
Proceedings Papers

Strain Monitoring Near Through Silicon Vias Using Metal Piezoresistive Sensors

Christine Taylor, Xi Liu, Suresh K. Sitaraman
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A042, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-40041
https://doi.org/10.1115/IMECE2014-40041
View Paper titled, Strain Monitoring Near Through Silicon Vias Using Metal Piezoresistive Sensors
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Topics: Metals, Sensors, Silicon, Stress, Packaging, Energy consumption, Engineering simulation, Finite element analysis, Gages, High temperature
Proceedings Papers

Crowd-Funding for Inspiring Graduate Students to Educate K12 Students About STEM

Christine Taylor, Suresh K. Sitaraman
Proc. ASME. IMECE2014, Volume 5: Education and Globalization, V005T05A039, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-40039
https://doi.org/10.1115/IMECE2014-40039
View Paper titled, Crowd-Funding for Inspiring Graduate Students to Educate K12 Students About STEM
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Topics: Graduate students, Students, Electronic packaging, Nanotechnology, Cracking (Materials), Damage, Electrical engineering, Electronic packages, Engineering disciplines, Fracture (Process)
Proceedings Papers

Cohesive Zone Models to Predict Multiple White Bumps in Flip-Chip Assemblies

Sathyanarayanan Raghavan, Ilko Schmadlak, George Leal, Suresh K. Sitaraman
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A080, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-40199
https://doi.org/10.1115/IMECE2014-40199
View Paper titled, Cohesive Zone Models to Predict Multiple White Bumps in Flip-Chip Assemblies
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Topics: Flip-chip assemblies, Failure, Finite element model, Fracture (Process), Fracture mechanics, Microelectronic devices, Stress, Adhesives, Delamination, Dielectric materials
Proceedings Papers

Reliable Design of TSV in Free-Standing Wafers and 3D Integrated Packages

Xi Liu, Margaret Simmons-Matthews, Kurt P. Wachtler, Suresh K. Sitaraman
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 903-910, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-65767
https://doi.org/10.1115/IMECE2011-65767
View Paper titled, Reliable Design of TSV in Free-Standing Wafers and 3D Integrated Packages
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Topics: Design, Semiconductor wafers, Reliability, Silicon, Thermomechanics, Experimental design, Finite element analysis, Integrated circuits, Packaging, Semiconductor industry
Proceedings Papers

Parallel-Path Compliant Structures as Electrical Interconnects

Raphael Okereke, Karan Kacker, Suresh K. Sitaraman
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 479-485, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-38376
https://doi.org/10.1115/IMECE2010-38376
View Paper titled, Parallel-Path Compliant Structures as Electrical Interconnects
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Topics: Contamination, Design, Dielectric materials, Dimensions, Failure, Fatigue, Flip-chip devices, Fracture (Materials), Manufacturing, Oxidation
Proceedings Papers

Reliable Design of Electroplated Copper Through Silicon Vias

Xi Liu, Qiao Chen, Venkatesh Sundaram, Sriram Muthukumar, Rao R. Tummala, Suresh K. Sitaraman
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 497-506, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-39283
https://doi.org/10.1115/IMECE2010-39283
View Paper titled, Reliable Design of Electroplated Copper Through Silicon Vias
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Topics: Copper, Design, Silicon, Stress, Reliability, Manufacturing, Thermomechanics, Cracking (Materials), Deformation, Electroplating
Proceedings Papers

Single-Strip Decohesion Test to Characterize Nano-Scale Thin Film Delamination

Jiantao Zheng, Suresh K. Sitaraman
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1669-1677, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73495
https://doi.org/10.1115/IPACK2005-73495
View Paper titled, Single-Strip Decohesion Test to Characterize Nano-Scale Thin Film Delamination
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Topics: Delamination, Fracture toughness, Microscale devices, Nanoscale phenomena, Strips, Thin films
Proceedings Papers

A Fracture Mechanics Analysis of Underfill Delamination in Flip Chip Packages

Saketh Mahalingam, Sandeep Tonapi, Suresh K. Sitaraman
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1341-1346, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73493
https://doi.org/10.1115/IPACK2005-73493
View Paper titled, A Fracture Mechanics Analysis of Underfill Delamination in Flip Chip Packages
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Topics: Delamination, Flip-chip packages, Fracture mechanics, Fatigue, Flip-chip, Flip-chip devices, Solders, Adhesives, Computer simulation, Displacement
Proceedings Papers

Study of Electroplated Compliant G-Helix Chip-to-Substrate Interconnects

Qi Zhu, Lunyu Ma, Suresh K. Sitaraman
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 875-886, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35342
https://doi.org/10.1115/IPACK2003-35342
View Paper titled, Study of Electroplated Compliant G-Helix Chip-to-Substrate Interconnects
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Topics: Diluents, Displacement, Electroplating, Geometry, Integrated circuit fabrication, Manufacturing, Microelectromechanical systems, Optimization, Packaging, Photolithography
Proceedings Papers

Measurement of the Mode Mix Dependent Interfacial Fracture Toughness for a Ti/Si Interface Using a Modified Decohesion Test

Mitul B. Modi, Suresh K. Sitaraman
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 559-573, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35331
https://doi.org/10.1115/IPACK2003-35331
View Paper titled, Measurement of the Mode Mix Dependent Interfacial Fracture Toughness for a Ti/Si Interface Using a Modified Decohesion Test
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Topics: Fracture toughness, Fracture (Materials), Deformation, Delamination, Exergy, Integrated circuit fabrication, Microelectromechanical systems, Testing
Proceedings Papers

Characterization of Mechanical Properties of Thin Films by Nanoindentation Technique and Finite Element Simulation

Zhaohui Shan, Suresh K. Sitaraman
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 263-267, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39668
https://doi.org/10.1115/IMECE2002-39668
View Paper titled, Characterization of Mechanical Properties of Thin Films by Nanoindentation Technique and Finite Element Simulation
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Topics: Finite element analysis, Mechanical properties, Nanoindentation, Simulation, Thin films
Proceedings Papers

Study on the Choice of Constitutive and Fatigue Models in Solder Joint Life Prediction

Krishna Tunga, James Pyland, Raghuram V. Pucha, Suresh K. Sitaraman
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 329-335, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39676
https://doi.org/10.1115/IMECE2002-39676
View Paper titled, Study on the Choice of Constitutive and Fatigue Models in Solder Joint Life Prediction
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Topics: Constitutive equations, Fatigue, Solder joints, Solders, Fatigue life, Ball-Grid-Array packaging, Damage
Proceedings Papers

Modified Decohesion Test (MDT) for Interfacial Fracture Toughness Measurement in Microelectronic/MEMS Applications

Mitul B. Modi, Suresh K. Sitaraman
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 277-282, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39670
https://doi.org/10.1115/IMECE2002-39670
View Paper titled, Modified Decohesion Test (MDT) for Interfacial Fracture Toughness Measurement in Microelectronic/MEMS Applications
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Topics: Fracture (Materials), Fracture toughness, Microelectromechanical systems, Microelectronic devices, Thin films
Proceedings Papers

Process-Induced Stress Effect on Reliability of ChipSeal ® Passivation Technology

Yeong K. Kim, Rudolf Krondorfer, Suresh K. Sitaraman
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 369-377, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39681
https://doi.org/10.1115/IMECE2002-39681
View Paper titled, Process-Induced Stress Effect on Reliability of ChipSeal ® Passivation Technology
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Topics: Reliability, Stress, Metals, Design, Errors, Integrated circuits, Microelectronic devices, Modeling, Numerical analysis, Response surface methodology
Proceedings Papers

Enhanced Reliability of High Density Wiring (HDW) Substrates Through New Dielectric and Base Substrate Materials

Shashikant Hegde, Raghuram V. Pucha, Suresh K. Sitaraman
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 283-290, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39671
https://doi.org/10.1115/IMECE2002-39671
View Paper titled, Enhanced Reliability of High Density Wiring (HDW) Substrates Through New Dielectric and Base Substrate Materials
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Topics: Cracking (Materials), Density, Dielectric materials, Electrical wires, Fracture (Process), Reliability, Thermomechanics, Warping
Proceedings Papers

A Lithography-Based Compliant Chip-to-Substrate Wafer-Level Interconnect

Qi Zhu, Lunyu Ma, Suresh K. Sitaraman
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 353-359, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39679
https://doi.org/10.1115/IMECE2002-39679
View Paper titled, A Lithography-Based Compliant Chip-to-Substrate Wafer-Level Interconnect
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Topics: Lithography, Semiconductor wafers, Packaging, Design, Manufacturing, Diluents, Displacement, Electronic packaging, Geometry, Integrated circuit fabrication
Proceedings Papers

Mechanical and Electrical Study of Linear Spring and J-Spring

Lunyu Ma, Qi Zhu, Suresh K. Sitaraman
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 387-394, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39683
https://doi.org/10.1115/IMECE2002-39683
View Paper titled, Mechanical and Electrical Study of Linear Spring and J-Spring
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Topics: Springs, Semiconductor wafers, Semiconductors (Materials), Computer simulation, Geometry, Manufacturing, Stress, Density, Dimensions, Displacement
Proceedings Papers

Material Interaction Effects in the Reliability of High Density Interconnect (HDI) Boards

Saketh Mahalingam, Shashikant Hegde, Gnyaneshwar Ramakrishna, Raghuram V. Pucha, Suresh K. Sitaraman
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 165-170, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41645
https://doi.org/10.1115/IMECE2003-41645
View Paper titled, Material Interaction Effects in the Reliability of High Density Interconnect (HDI) Boards
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Topics: Density, Lumber, Reliability, Cracking (Materials), Fracture (Process), Algorithms, Deformation, Design, Dielectric materials, Optimization