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Proceedings Papers

Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

John H. Lau, Stephen H. Pan, Chris Chang
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 79-89, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2249
https://doi.org/10.1115/IMECE2000-2249
View Paper titled, Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board
Open the PDF for Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board in another window
Topics: Creep, Lead-free solders, Printed circuit boards, Semiconductor wafers, Alloys, Shear (Mechanics), Shear stress, Solder joints, Solders, Constitutive equations
Proceedings Papers

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

John H. Lau, S. W. Ricky Lee, Stephen H. Pan, Chris Chang
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 135-144, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2255
https://doi.org/10.1115/IMECE2000-2255
View Paper titled, Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications
Open the PDF for Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications in another window
Topics: Flip-chip, Flip-chip devices, Solders, Creep, Solder joints, Cross section (Physics), Design, Printed circuit board assemblies, Printed circuit boards, Reliability
Proceedings Papers

A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints

John H. Lau, Stephen H. Pan, Chris Chang
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 91-101, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2250
https://doi.org/10.1115/IMECE2000-2250
View Paper titled, A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints
Open the PDF for A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints in another window
Topics: Fatigue, Semiconductor wafers, Solder joints, Fracture (Materials), Corners (Structural elements), Creep, Cycles, Density, Finite element methods, Fracture mechanics
Proceedings Papers

IC-Package Thermal Co-Analysis in 3D IC Environment

Stephen H. Pan, Norman Chang, Ji Zheng
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 335-341, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52240
https://doi.org/10.1115/IPACK2011-52240
View Paper titled, IC-Package Thermal Co-Analysis in 3D IC Environment
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Topics: Design, Electrodiffusion, Leakage, Power density, Reliability, Temperature, Temperature distribution
Journal Articles

3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components

John H. Lau, Stephen H. Pan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2003, 125(4): 621–624.
https://doi.org/10.1115/1.1604805
Published Online: December 15, 2003
View Article titled, 3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components
Open the PDF for 3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components in another window
Topics: Boundary-value problems, Compressive stress, Copper, Finite element analysis, Stress, Stress analysis (Engineering), Tin, Chemical reactions, Displacement, Materials properties
Journal Articles

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

John H. Lau, Fellow ASME, S. W. Ricky Lee, Stephen H. Pan, Chris Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 205–211.
https://doi.org/10.1115/1.1462626
Published Online: July 26, 2002
View Article titled, Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications
Open the PDF for Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications in another window
Topics: Creep, Flip-chip devices, Solder joints, Solders, Flip-chip, Printed circuit board assemblies
Journal Articles

A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints

John H. Lau, Fellow ASME, Stephen H. Pan, Chris Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 212–220.
https://doi.org/10.1115/1.1462625
Published Online: July 26, 2002
View Article titled, A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints
Open the PDF for A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints in another window
Topics: Corners (Structural elements), Fracture (Materials), Solder joints, Fatigue, Density, Semiconductor wafers, Cycles
Journal Articles

Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

John H. Lau, Fellow ASME, Stephen H. Pan, Chris Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 69–76.
https://doi.org/10.1115/1.1400995
Published Online: May 2, 2002
View Article titled, Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board
Open the PDF for Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board in another window
Topics: Creep, Solder joints, Lead-free solders, Solders, Shear (Mechanics), Corners (Structural elements), Shear stress, Stress, Printed circuit board assemblies, Reliability