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Journal Articles

Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack

R. K. Govila, Y.-H. Pao, C. Larner, J. Lau, S. Twerefour, S. Erasmus, S. Dolot
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 184–190.
https://doi.org/10.1115/1.2905684
Published Online: September 1, 1994
View Article titled, Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack
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Topics: Failure analysis, Solder joints, Water, Solders, Cycles, Crack propagation, Cracking (Materials), Failure, Failure mechanisms, Fatigue damage
Journal Articles

Solder Joint Reliability of Surface Mount Connectors

J. Lau, T. Marcotte, J. Severine, A. Lee, S. Erasmus, T. Baker, J. Moldaschel, M. Sporer, G. Burward-Hoy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 180–188.
https://doi.org/10.1115/1.2909315
Published Online: June 1, 1993
View Article titled, Solder Joint Reliability of Surface Mount Connectors
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Topics: Reliability, Solder joints, Surface mount packaging, Experimental methods
Journal Articles

Experimental and Analytical Studies of 28-Pin Thin Small Outline Package (TSOP) Solder-Joint Reliability

J. Lau, S. Golwalkar, S. Erasmus, R. Surratt, P. Boysan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 169–176.
https://doi.org/10.1115/1.2906414
Published Online: June 1, 1992
View Article titled, Experimental and Analytical Studies of 28-Pin Thin Small Outline Package (TSOP) Solder-Joint Reliability
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Topics: Reliability, Solder joints, Temperature, Corners (Structural elements), Failure, Failure analysis, Fatigue, Fatigue life, Finite element analysis, Scanning electron microscopy
Journal Articles

Fatigue Analysis of a Ceramic Pin Grid Array Soldered to an Orthotropic Epoxy Substrate

J. Lau, R. Subrahmanyan, D. Rice, S. Erasmus, C. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 138–148.
https://doi.org/10.1115/1.2905379
Published Online: June 1, 1991
View Article titled, Fatigue Analysis of a Ceramic Pin Grid Array Soldered to an Orthotropic Epoxy Substrate
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Topics: Ceramics, Epoxy adhesives, Epoxy resins, Fatigue analysis, Copper, Solder joints, Thermal expansion, Fatigue, Reliability, Solders