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Journal Articles

Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging

Pradeep Lall, Hyesoo Jang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021006.
Paper No: EP-24-1003
https://doi.org/10.1115/1.4067266
Published Online: January 23, 2025
View Article titled, Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging
Open the PDF for Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging in another window
Topics: Batteries, Cycles, Simulation, Stress, Engineering simulation, Lithium-ion batteries, Electrodes
Proceedings Papers

Comparative Performance Analysis of Screen-Printed Structures on PET and BPET Substrates Utilizing Low-Temperature ECA and MACA for SMD Component Attachment

Pradeep Lall, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A010, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141881
https://doi.org/10.1115/IPACK2024-141881
View Paper titled, Comparative Performance Analysis of Screen-Printed Structures on PET and BPET Substrates Utilizing Low-Temperature ECA and MACA for SMD Component Attachment
Open the PDF for Comparative Performance Analysis of Screen-Printed Structures on PET and BPET Substrates Utilizing Low-Temperature ECA and MACA for SMD Component Attachment in another window
Topics: Biodegradation, Cellulose, Circuits, Electronics, Errors, Low temperature, Manufacturing, Printing, Sanitary landfills, Stability
Proceedings Papers

Additively Printed Circuits Using Biodegradable Substrates on Aerosol-Jet With Aqueous-Based Silver Conductive Paste Using ECA and Low-Temperature Interconnects

Pradeep Lall, Daniel Karakitie, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A009, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141879
https://doi.org/10.1115/IPACK2024-141879
View Paper titled, Additively Printed Circuits Using Biodegradable Substrates on Aerosol-Jet With Aqueous-Based Silver Conductive Paste Using ECA and Low-Temperature Interconnects
Open the PDF for Additively Printed Circuits Using Biodegradable Substrates on Aerosol-Jet With Aqueous-Based Silver Conductive Paste Using ECA and Low-Temperature Interconnects in another window
Topics: Aerosols, Biodegradation, Circuits, Inks, Low temperature, Silver, Water
Proceedings Papers

Sequential High Humidity and Isothermal Evolution of UF-Substrate Interface

Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A032, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-143310
https://doi.org/10.1115/IPACK2024-143310
View Paper titled, Sequential High Humidity and Isothermal Evolution of UF-Substrate Interface
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Topics: Damage, Delamination, Displacement, Failure, Fracture (Materials), High temperature, Reliability, Stress
Proceedings Papers

Hygrothermal Aging Evolution of Non-PFAS FCBGA Interfaces

Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan, Madhu Kasturi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A031, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-143308
https://doi.org/10.1115/IPACK2024-143308
View Paper titled, Hygrothermal Aging Evolution of Non-PFAS FCBGA Interfaces
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Topics: Copper, Delamination, Diseases, Displacement, Electronics, Fracture (Materials), High temperature, Liver, Reliability, Stress
Proceedings Papers

Sequential High-Temperature Aging and High Humidity Exposure of Chip/Underfill Interfaces to Investigate the Evolution of Interfacial Stress Intensity Factor in FCBGA Stress Intensity

Pradeep Lall, Aathi Pandurangan, Padmanava Choudhury
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A028, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142108
https://doi.org/10.1115/IPACK2024-142108
View Paper titled, Sequential High-Temperature Aging and High Humidity Exposure of Chip/Underfill Interfaces to Investigate the Evolution of Interfacial Stress Intensity Factor in FCBGA Stress Intensity
Open the PDF for Sequential High-Temperature Aging and High Humidity Exposure of Chip/Underfill Interfaces to Investigate the Evolution of Interfacial Stress Intensity Factor in FCBGA Stress Intensity in another window
Topics: Delamination, Fracture (Materials), Fracture toughness, High temperature, Stress
Proceedings Papers

Evaluation of Additively Printed Filters on High-Temperature Performance on the Aerojet Platform Using Ceramics Substrate and Laser Ablation Process

Pradeep Lall, Daniel Karakitie, Ved Soni, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A012, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142110
https://doi.org/10.1115/IPACK2024-142110
View Paper titled, Evaluation of Additively Printed Filters on High-Temperature Performance on the Aerojet Platform Using Ceramics Substrate and Laser Ablation Process
Open the PDF for Evaluation of Additively Printed Filters on High-Temperature Performance on the Aerojet Platform Using Ceramics Substrate and Laser Ablation Process in another window
Topics: Additive manufacturing, Aerosols, Ceramics, Circuits, Filters, High temperature, Inks, Laser ablation
Proceedings Papers

Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate (PC) and High Impact Polystyrene (HIPS) Substrates Under Sustained High Temperatures for In-Mold Electronics

Pradeep Lall, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A011, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141889
https://doi.org/10.1115/IPACK2024-141889
View Paper titled, Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate (PC) and High Impact Polystyrene (HIPS) Substrates Under Sustained High Temperatures for In-Mold Electronics
Open the PDF for Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate (PC) and High Impact Polystyrene (HIPS) Substrates Under Sustained High Temperatures for In-Mold Electronics in another window
Topics: Electronics, High temperature, Printing, Reliability
Proceedings Papers

Thermal Cycling Reliability on Encapsulated Flexible Printed Circuit Fabricated With Water-Based Ink and Room-Temperature Curable Adhesive

Pradeep Lall, Sabina Bimali, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A004, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141858
https://doi.org/10.1115/IPACK2024-141858
View Paper titled, Thermal Cycling Reliability on Encapsulated Flexible Printed Circuit Fabricated With Water-Based Ink and Room-Temperature Curable Adhesive
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Topics: Adhesives, Aerosols, Circuits, Printing, Reliability, Sustainability, Temperature, Water based printing inks
Proceedings Papers

State of Health Estimation Model Development for Li-Ion Battery Lifetime Considering Calendar Aging and Post-Knee Degradation

Pradeep Lall, Ved Soni, Sabina Bimali
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A030, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142117
https://doi.org/10.1115/IPACK2024-142117
View Paper titled, State of Health Estimation Model Development for Li-Ion Battery Lifetime Considering Calendar Aging and Post-Knee Degradation
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Topics: Batteries, Battery life, Knee, Lithium-ion batteries, Model development
Proceedings Papers

Investigation of Interfacial Reliability and Comparison Non-PFAS Underfills in FCBGAs Under Humidity and High-Temperature Exposure

Pradeep Lall, Aathi Pandurangan, Padmanava Choudhury
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A029, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142109
https://doi.org/10.1115/IPACK2024-142109
View Paper titled, Investigation of Interfacial Reliability and Comparison Non-PFAS Underfills in FCBGAs Under Humidity and High-Temperature Exposure
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Topics: Delamination, Fracture toughness, High temperature, Reliability, Failure mechanisms, Semiconductors (Materials), Automobiles, Ball-Grid-Array packaging, Durability, Electronics
Proceedings Papers

Effect of Bismuth Concentration on the High Strain Rate Characteristics of Sn-Ag-Cu Solders and Analysis of High-g Level Shock Damage During Extended Sustained Operation at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A024, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141850
https://doi.org/10.1115/IPACK2024-141850
View Paper titled, Effect of Bismuth Concentration on the High Strain Rate Characteristics of Sn-Ag-Cu Solders and Analysis of High-g Level Shock Damage During Extended Sustained Operation at 100°C
Open the PDF for Effect of Bismuth Concentration on the High Strain Rate Characteristics of Sn-Ag-Cu Solders and Analysis of High-g Level Shock Damage During Extended Sustained Operation at 100°C in another window
Topics: Damage, Shock (Mechanics), Solders, Temperature, Testing, Tin, Viscoplasticity
Proceedings Papers

Study on the Impact of Prolonged High-Temperature Exposure on the Reliability of Lead-Free Solder Joint Assemblies Under Vibration

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A023, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141845
https://doi.org/10.1115/IPACK2024-141845
View Paper titled, Study on the Impact of Prolonged High-Temperature Exposure on the Reliability of Lead-Free Solder Joint Assemblies Under Vibration
Open the PDF for Study on the Impact of Prolonged High-Temperature Exposure on the Reliability of Lead-Free Solder Joint Assemblies Under Vibration in another window
Topics: Finite element analysis, High temperature, Lead-free solders, Reliability, Solders, Vibration
Proceedings Papers

Water-Based Inks and Low-Temperature Interconnects for Direct-Write Fabrication of Flexible Electronics Under Thermal Cycling

Pradeep Lall, Fatahi Musa, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141871
https://doi.org/10.1115/IPACK2024-141871
View Paper titled, Water-Based Inks and Low-Temperature Interconnects for Direct-Write Fabrication of Flexible Electronics Under Thermal Cycling
Open the PDF for Water-Based Inks and Low-Temperature Interconnects for Direct-Write Fabrication of Flexible Electronics Under Thermal Cycling in another window
Topics: Electronics, Flexible electronics, Low temperature, Manufacturing, Water based printing inks, Bonding, Electrical conductivity, Inks, Accelerated life testing, Additive manufacturing
Proceedings Papers

Performance and Reliability of In-Mold Direct-Write Signal Processing Circuits in Sustained High-Temperature Operation

Pradeep Lall, Md Golam Sarwar, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141863
https://doi.org/10.1115/IPACK2024-141863
View Paper titled, Performance and Reliability of In-Mold Direct-Write Signal Processing Circuits in Sustained High-Temperature Operation
Open the PDF for Performance and Reliability of In-Mold Direct-Write Signal Processing Circuits in Sustained High-Temperature Operation in another window
Topics: Adhesives, Circuits, High temperature, Printing, Reliability, Signal processing
Proceedings Papers

Sequential High Temperature and Hygrothermal Exposure on the Evolution of Interfacial Fracture Toughness of TIM-Copper and EMC Interfaces

Pradeep Lall, Madhu Kasturi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A026, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141853
https://doi.org/10.1115/IPACK2024-141853
View Paper titled, Sequential High Temperature and Hygrothermal Exposure on the Evolution of Interfacial Fracture Toughness of TIM-Copper and EMC Interfaces
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Topics: Copper, Fracture toughness, High temperature
Proceedings Papers

Evolution of Non-PFAS Underfill Properties Under High-Temperature Storage and Hygrothermal Exposure

Pradeep Lall, Madhu Kasturi, Leyton Janowsky, Edward Davis
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A025, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141852
https://doi.org/10.1115/IPACK2024-141852
View Paper titled, Evolution of Non-PFAS Underfill Properties Under High-Temperature Storage and Hygrothermal Exposure
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Topics: High temperature, Oxidation, Storage
Proceedings Papers

Process-Performance Interactions Under Exposure to Sustained High Temperature for Additively Manufactured Electronics and SMT Assembly With Low-Temperature Curable Adhesives

Pradeep Lall, Sabina Bimali, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A027, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141856
https://doi.org/10.1115/IPACK2024-141856
View Paper titled, Process-Performance Interactions Under Exposure to Sustained High Temperature for Additively Manufactured Electronics and SMT Assembly With Low-Temperature Curable Adhesives
Open the PDF for Process-Performance Interactions Under Exposure to Sustained High Temperature for Additively Manufactured Electronics and SMT Assembly With Low-Temperature Curable Adhesives in another window
Topics: Additive manufacturing, Adhesives, Aerosols, Electronics, High temperature, Low temperature, Manufacturing, Printing
Proceedings Papers

Oscillator Performance on Thermoformed Additive In-Mold Electronics for Automotive Applications

Pradeep Lall, Aditya Harsha, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A008, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141877
https://doi.org/10.1115/IPACK2024-141877
View Paper titled, Oscillator Performance on Thermoformed Additive In-Mold Electronics for Automotive Applications
Open the PDF for Oscillator Performance on Thermoformed Additive In-Mold Electronics for Automotive Applications in another window
Topics: Automotive industry, Electronics, Printing
Proceedings Papers

Thermal Cycling Reliability of In-Mold Direct Write Additively Printed Integrator and Active Low-Pass Filter

Pradeep Lall, Fatahi Musa, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A007, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141874
https://doi.org/10.1115/IPACK2024-141874
View Paper titled, Thermal Cycling Reliability of In-Mold Direct Write Additively Printed Integrator and Active Low-Pass Filter
Open the PDF for Thermal Cycling Reliability of In-Mold Direct Write Additively Printed Integrator and Active Low-Pass Filter in another window
Topics: Filters, Low-pass filters, Reliability, Automobiles, Durability, Electronics, Adhesives, Computer software, Cutting, Engineering simulation