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Journal Articles

Theoretical Analysis of Free Vibration and Transient Response of Rectangular Plate–Cavity System Under Impact Loading

Ming Ji, Kazuaki Inaba
Journal: Journal of Pressure Vessel Technology
Article Type: Research-Article
J. Pressure Vessel Technol. June 2023, 145(3): 031402.
Paper No: PVT-21-1204
https://doi.org/10.1115/1.4062121
Published Online: March 24, 2023
View Article titled, Theoretical Analysis of Free Vibration and Transient Response of Rectangular Plate–Cavity System Under Impact Loading
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Topics: Cavities, Fluids, Free vibrations, Mode shapes, Plate theory, Resonance, Transients (Dynamics), Theoretical analysis, Displacement
Proceedings Papers

Forward and Inverse Problems in Transient Responses of Plates Under Impact Loadings

Ming Ji, Kazuaki Inaba
Proc. ASME. PVP2022, Volume 3: Fluid-Structure Interaction; High Pressure Technology, V003T04A013, July 17–22, 2022
Paper No: PVP2022-83685
https://doi.org/10.1115/PVP2022-83685
View Paper titled, Forward and Inverse Problems in Transient Responses of Plates Under Impact Loadings
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Topics: Inverse problems, Plates (structures), Transients (Dynamics), Wavelets
Journal Articles

Efficient Theoretical and Numerical Methods for Solving Free Vibrations and Transient Responses of a Circular Plate Coupled With Fluid Subjected to Impact Loadings

Ming Ji, Kazuaki Inaba
Journal: Journal of Pressure Vessel Technology
Article Type: Research-Article
J. Pressure Vessel Technol. October 2021, 143(5): 051401.
Paper No: PVT-20-1256
https://doi.org/10.1115/1.4050319
Published Online: March 22, 2021
View Article titled, Efficient Theoretical and Numerical Methods for Solving Free Vibrations and Transient Responses of a Circular Plate Coupled With Fluid Subjected to Impact Loadings
Open the PDF for Efficient Theoretical and Numerical Methods for Solving Free Vibrations and Transient Responses of a Circular Plate Coupled With Fluid Subjected to Impact Loadings in another window
Topics: Fluids, Plate theory, Free vibrations, Transients (Dynamics)
Proceedings Papers

Efficient and Flexible Finite Element Procedure for Free and Forced Vibration Problems of a Plate Coupled With Fluid

Ming Ji, Kazuaki Inaba
Proc. ASME. PVP2020, Volume 4: Fluid-Structure Interaction, V004T04A013, August 3, 2020
Paper No: PVP2020-21535
https://doi.org/10.1115/PVP2020-21535
View Paper titled, Efficient and Flexible Finite Element Procedure for Free and Forced Vibration Problems of a Plate Coupled With Fluid
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Topics: Finite element analysis, Fluid structure interaction, Fluids, Transients (Dynamics), Vibration, Eigenvalues, Aircraft, Computer software, Engineering design, Finite element methods
Proceedings Papers

Theoretical Analysis of Free Vibrations Based on a New High Order Shell Theory for Cylindrical Shells Conveying Fluid

Ming Ji, Kazuaki Inaba
Proc. ASME. PVP2017, Volume 5: High-Pressure Technology; ASME Nondestructive Evaluation, Diagnosis and Prognosis Division (NDPD); SPC Track for Senate, V005T11A015, July 16–20, 2017
Paper No: PVP2017-65604
https://doi.org/10.1115/PVP2017-65604
View Paper titled, Theoretical Analysis of Free Vibrations Based on a New High Order Shell Theory for Cylindrical Shells Conveying Fluid
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Topics: Fluids, Free vibrations, Pipes, Shells, Theoretical analysis, Flow (Dynamics), Boundary-value problems, Equations of motion, Finite element methods, Finite element model
Proceedings Papers

The Numerical Study for the Thermal Characteristics of 3D Vertical Stacked Die Packages

Chih-Kuang Yu, Ming-Che Hsieh, Chun-Kai Liu, Ming-Ji Dai, Ra-Min Tain
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 507-512, July 19–23, 2009
Paper No: InterPACK2009-89242
https://doi.org/10.1115/InterPACK2009-89242
View Paper titled, The Numerical Study for the Thermal Characteristics of 3D Vertical Stacked Die Packages
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Topics: Engineering simulation, Finite volume methods, Heat transfer, Junctions, Materials properties, Silicon, Simulation, Temperature, Temperature distribution, Thermal conductivity
Proceedings Papers

High Power LED Integrated With Silicon-Based Thermoelectric Cooler Package

Ming-Ji Dai, Chih-Kuang Yu, Chun Kai Liu, Sheng-Liang Kuo
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 229-233, July 8–12, 2007
Paper No: IPACK2007-33369
https://doi.org/10.1115/IPACK2007-33369
View Paper titled, High Power LED Integrated With Silicon-Based Thermoelectric Cooler Package
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Topics: Silicon, Thermoelectric coolers, Cooling, Flip-chip assemblies, Junctions, Light-emitting diodes, Manufacturing, Microelectromechanical systems, Packaging, Temperature
Proceedings Papers

Thermal Conductivity of Si/SiGe Superlattice Film

Chun-Kai Liu, Heng-Chieh Chien, Ming-Ji Dai, Chih-Kuang Yu, Chun-Yeh Hsu, Mei-Jiau Huang, Guang-Li Luo
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 365-369, June 6–9, 2008
Paper No: MNHT2008-52183
https://doi.org/10.1115/MNHT2008-52183
View Paper titled, Thermal Conductivity of Si/SiGe Superlattice Film
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Topics: Superlattices, Thermal conductivity