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Michal Talmor
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. April 2024, 146(4): 041601.
Paper No: HT-23-1266
Published Online: January 29, 2024
Journal Articles
Nathaniel J. O'Connor, Alexander J. Castaneda, Pavolas N. Christidis, Nicolas Vayas Tobar, Michal Talmor, Jamal Yagoobi
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041105.
Paper No: EP-20-1021
Published Online: June 23, 2020
Proceedings Papers
Nicolas Vayas Tobar, Pavolas N. Christidis, Nathaniel J. O'Connor, Michal Talmor, Jamal Seyed-Yagoobi
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8322
Proceedings Papers
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A024, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74107
Proceedings Papers
Proc. ASME. IMECE2016, Volume 8: Heat Transfer and Thermal Engineering, V008T10A091, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-66222