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Martine Baelmans
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Journal Articles

Electronics Cooling System and Component Design According to the Second Law

Ruben Gielen, Martine Baelmans
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2014, 136(5): 051401.
Paper No: HT-13-1053
https://doi.org/10.1115/1.4026058
Published Online: February 26, 2014
View Article titled, Electronics Cooling System and Component Design According to the Second Law
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Topics: Design, Entropy, Heat exchangers, Heat sinks, Temperature, Water
Journal Articles

Effect of Flow Pulsation on the Heat Transfer Performance of a Minichannel Heat Sink

Tim Persoons, Tom Saenen, Tijs Van Oevelen, Martine Baelmans
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Forced Convection
J. Heat Mass Transfer. September 2012, 134(9): 091702.
https://doi.org/10.1115/1.4006485
Published Online: July 9, 2012
View Article titled, Effect of Flow Pulsation on the Heat Transfer Performance of a Minichannel Heat Sink
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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Pulsatile flow
Proceedings Papers

Design Optimization and Validation of Single-Phase Rectangular Micro Channels With Axial Non-Uniform Width

Tijs Van Oevelen, Martine Baelmans
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 49-58, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22429
https://doi.org/10.1115/IHTC14-22429
View Paper titled, Design Optimization and Validation of Single-Phase Rectangular Micro Channels With Axial Non-Uniform Width
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Topics: Design, Microchannels, Optimization, Computer simulation, Flow (Dynamics), Heat transfer, Simulation, Thermal resistance
Proceedings Papers

Modeling Size Effects of a Portable Two-Phase Electronics Cooling Loop With Different Refrigerants

Tom Saenen, Martine Baelmans
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 535-545, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22770
https://doi.org/10.1115/IHTC14-22770
View Paper titled, Modeling Size Effects of a Portable Two-Phase Electronics Cooling Loop With Different Refrigerants
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Topics: Computer cooling, Modeling, Refrigerants, Microchannels, Secondary cells, Algorithms, Coolants, Cooling systems, Dynamic systems, Finite volume methods
Journal Articles

Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies

Bart Vandevelde, Eric Beyne, Dirk Vandepitte, Martine Baelmans
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 351–358.
https://doi.org/10.1115/1.1772416
Published Online: October 6, 2004
View Article titled, Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies
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Topics: Flip-chip assemblies, Stress, Thermomechanics, Flip-chip devices, Deformation, Structural mechanics, Finite element model
Journal Articles

Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies

Bart Vandevelde, Eric Beyne, Kouchi (G.Q.) Zhang, Jo Caers, Dirk Vandepitte, Martine Baelmans
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 498–505.
https://doi.org/10.1115/1.1604150
Published Online: December 15, 2003
View Article titled, Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies
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Topics: Finite element analysis, Reliability, Simulation, Solder joints, Solders, Modeling, Thermomechanics, Sensitivity analysis, Design, Dimensions