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Madhavan Swaminathan
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Proceedings Papers

Parametric Thermal Design for Heterogeneously Integrated High-Power Packages

Yunhyeok Im, Junyoung Kim, Mingeun Choi, Myriam Bouzidi, Xingchen Li, Joon Woo Kim, Ahmet Mete Muslu, Satish Kumar, Madhavan Swaminathan, Suresh K. Sitaraman, Yogendra Joshi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141216
https://doi.org/10.1115/IPACK2024-141216
View Paper titled, Parametric Thermal Design for Heterogeneously Integrated High-Power Packages
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Topics: Cooling, Design, Silicon
Journal Articles

A Heterogeneous Array of Off-Chip Interconnects for Optimum Mechanical and Electrical Performance

Karan Kacker, Thomas Sokol, Wansuk Yun, Madhavan Swaminathan, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 460–468.
https://doi.org/10.1115/1.2804096
Published Online: April 9, 2007
View Article titled, A Heterogeneous Array of Off-Chip Interconnects for Optimum Mechanical and Electrical Performance
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Topics: Automotive design, Manufacturing, Reliability, Dielectric materials, Stress, Thermomechanics, Semiconductor wafers, Finite element analysis, Fracture (Materials)