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M. Pecht
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Proceedings Papers

Effect of Hygroscopic Swelling of Mold Compound on PEM Reliability

B. Han, E. Stellrecht, M. Pecht
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 371-372, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42223
https://doi.org/10.1115/IMECE2003-42223
View Paper titled, Effect of Hygroscopic Swelling of Mold Compound on PEM Reliability
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Topics: Proton exchange membranes, Reliability, Semiconductors (Materials), Stress
Journal Articles

A Statistical Mechanical Model of Electrical Carbon Fiber Contacts

J. Xie, M. Pecht, A. Dasgupta, J. A. Swift, S. J. Wallace
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 286–290.
https://doi.org/10.1115/1.2793854
Published Online: December 1, 1999
View Article titled, A Statistical Mechanical Model of Electrical Carbon Fiber Contacts
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Topics: Carbon fibers, Contact resistance, Fibers, Geometry
Journal Articles

Failure Analysis of Liquid Crystal Displays Due to Indium Tin Oxide Breakdown

T. J. Dishoungh, M. Dube, M. Pecht, J. Wyler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 1999, 121(2): 126–127.
https://doi.org/10.1115/1.2792667
Published Online: June 1, 1999
View Article titled, Failure Analysis of Liquid Crystal Displays Due to Indium Tin Oxide Breakdown
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Topics: Failure analysis, Liquid crystals
Journal Articles

Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic

J. M. Hu, D. Barker, R. Ghoshtagore, M. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 148–153.
https://doi.org/10.1115/1.2905503
Published Online: June 1, 1994
View Article titled, Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic
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Topics: Ceramics, Low temperature, Thermomechanics, Temperature, Bending strength, Design, Elastic moduli, Electronic packages, Fracture toughness, Materials properties
Journal Articles

Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach

A. Dasgupta, C. Oyan, D. Barker, M. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 152–160.
https://doi.org/10.1115/1.2906412
Published Online: June 1, 1992
View Article titled, Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach
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Topics: Creep, Fatigue, Solders, Temperature, Cycles, Damage, Finite element methods, Solder joints, Stress, Constitutive equations
Journal Articles

Influence of Selected Design Variables on Thermo-Mechanical Stress Distributions in Plated-Through-Hole Structures

S. M. Bhandarkar, A. Dasgupta, D. Barker, M. Pecht, W. Engelmaier
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 8–13.
https://doi.org/10.1115/1.2905447
Published Online: March 1, 1992
View Article titled, Influence of Selected Design Variables on Thermo-Mechanical Stress Distributions in Plated-Through-Hole Structures
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Topics: Design, Stress, Thermomechanics, Finite element methods, Failure, Anisotropy, Boundary-value problems, Epoxy adhesives, Epoxy resins, Fatigue life
Journal Articles

Transient Thermal Stress Analysis of a Plated Through Hole Subjected to Wave Soldering

D. Barker, M. Pecht, A. Dasgupta, S. Naqvi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 149–155.
https://doi.org/10.1115/1.2905380
Published Online: June 1, 1991
View Article titled, Transient Thermal Stress Analysis of a Plated Through Hole Subjected to Wave Soldering
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Topics: Thermal stresses, Transients (Dynamics), Wave soldering, Stress, Temperature, Anisotropy, Damage, Fatigue life, Fracture (Materials), Heat transfer
Journal Articles

Combined Vibrational and Thermal Solder Joint Fatigue—A Generalized Strain Versus Life Approach

D. Barker, J. Vodzak, A. Dasgupta, M. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 129–134.
https://doi.org/10.1115/1.2904353
Published Online: June 1, 1990
View Article titled, Combined Vibrational and Thermal Solder Joint Fatigue—A Generalized Strain Versus Life Approach
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Topics: Fatigue, Solder joints, Cycles, Stress, Fatigue life, Reliability, Solders, Approximation, Damage, Failure
Journal Articles

Component Placement for Reliability on Conductively Cooled Printed Wiring Boards

M. D. Osterman, M. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1989, 111(2): 149–156.
https://doi.org/10.1115/1.3226521
Published Online: June 1, 1989
View Article titled, Component Placement for Reliability on Conductively Cooled Printed Wiring Boards
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Topics: Printed circuit boards, Reliability, Electronic equipment, Failure, Packaging