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M. Uschitsky
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Proceedings Papers

Predicted Dynamic Strength and Durability of a Network Interface Unit (NIU) Enclosure

M. Uschitsky, E. Suhir, L. Shepherd, W. R. Lambert, M. A. Zimmerman
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 1-36, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0720
https://doi.org/10.1115/IMECE1996-0720
View Paper titled, Predicted Dynamic Strength and Durability of a Network Interface Unit (NIU) Enclosure
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Topics: Design, Durability, Dynamic response, Fracture (Materials), Fracture (Process), Reliability, Service life (Equipment), Shock (Mechanics), Stress, Structural analysis
Proceedings Papers

Finite Element Analysis of Optical Fiber Structures

B. R. Welker, M. Uschitsky, E. Suhir, S. Kher, G. Bubel
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 181-191, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0733
https://doi.org/10.1115/IMECE1996-0733
View Paper titled, Finite Element Analysis of Optical Fiber Structures
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Topics: Finite element analysis, Optical fiber, Stress, Composite materials, Computer software, Design, Epoxy adhesives, Geometry, Metals, Modeling
Proceedings Papers

Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner

M. Uschitsky, E. Suhir
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 67-100, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0724
https://doi.org/10.1115/IMECE1996-0724
View Paper titled, Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner
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Topics: Corners (Structural elements), Epoxy adhesives, Epoxy resins, Molding, Stress, Delamination, Adhesion, Fracture (Materials), Reliability, Design
Proceedings Papers

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

M. Uschitsky, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 141-170, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0818
https://doi.org/10.1115/IMECE1997-0818
View Paper titled, Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles
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Topics: Diffusion (Physics), Epoxy adhesives, Epoxy resins, Molding, Particulate matter, Fillers (Materials), Stress, Weight (Mass), Electronic packaging, Indium compounds
Proceedings Papers

Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure

M. Uschitsky, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 33-54, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0813
https://doi.org/10.1115/IMECE1997-0813
View Paper titled, Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure
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Topics: Epoxy adhesives, Epoxy resins, Glass fibers, Stress, Fibers, Buckling, Delamination, Design, Metals, Optical fiber
Proceedings Papers

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, E. Suhir, G. W. Kammlott
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 171-206, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0819
https://doi.org/10.1115/IMECE1997-0819
View Paper titled, Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach
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Topics: Composite materials, Molding, Thermoelasticity, Fillers (Materials), Thermal stresses, Epoxy adhesives, Epoxy resins, Design, Integrated circuits, Reliability
Journal Articles

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, Member ASME, E. Suhir, Fellow ASME, G. W. Kammlott
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 260–267.
https://doi.org/10.1115/1.1349422
Published Online: January 11, 2000
View Article titled, Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach
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Topics: Composite materials, Epoxy adhesives, Epoxy resins, Fillers (Materials), Molding, Particulate matter, Thermal expansion, Elastic moduli, Thermal stresses, Shear modulus
Journal Articles

Moisture Diffusion in Epoxy Molding Compounds Filled With Particles

M. Uschitsky, E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 47–51.
https://doi.org/10.1115/1.1325009
Published Online: September 2, 1998
View Article titled, Moisture Diffusion in Epoxy Molding Compounds Filled With Particles
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Topics: Diffusion (Physics), Epoxy adhesives, Epoxy resins, Fillers (Materials), Mechanical properties, Molding, Particulate matter, Sorption, Indium compounds, Stress