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Proceedings Papers

Large Deflection Effects on Micro Diaphragms: A Theoretical and Experimental Study

Liwei Lin, Huey-Chi Chu
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 447-452, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1388
https://doi.org/10.1115/IMECE1996-1388
View Paper titled, Large Deflection Effects on Micro Diaphragms: A Theoretical and Experimental Study
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Topics: Deflection, Diaphragms (Mechanical devices), Diaphragms (Structural), Pressure sensors, Errors, Shapes, Plates (structures), Resistors, Shells, Transducers
Proceedings Papers

Microactuators Based on Electrothermal Expansion of Clamped-Clamped Beams

Mu Chiao, Liwei Lin
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 75-80, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0942
https://doi.org/10.1115/IMECE1997-0942
View Paper titled, Microactuators Based on Electrothermal Expansion of Clamped-Clamped Beams
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Topics: Microactuators, Microbeams, Computers, Displacement, Image processing, Micromachining, Polysilicon, Thermoelasticity
Proceedings Papers

Fabrication of 109.5° Micro V-Grooves Using a Two-Step Anisotropic Etching Technique

Wen-Tien Chang Chien, Liwei Lin, Yi-Chung Lo, Chia-Ou Chang
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 361-364, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1269
https://doi.org/10.1115/IMECE1998-1269
View Paper titled, Fabrication of 109.5° Micro V-Grooves Using a Two-Step Anisotropic Etching Technique
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Topics: Anisotropy, Etching, Manufacturing, Shapes, Design, Microelectromechanical systems, Semiconductor wafers
Proceedings Papers

Design, Fabrication and Optical Characterization of Micro Fresnel Zone Plates

Wen-Hong Lee, Liwei Lin
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 505-511, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1292
https://doi.org/10.1115/IMECE1998-1292
View Paper titled, Design, Fabrication and Optical Characterization of Micro Fresnel Zone Plates
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Topics: Design, Manufacturing, Plates (structures), Gamma rays, Glass, Helium-neon lasers, Image formation, Infrared radiation, Membranes, Stress
Proceedings Papers

Localized Deposition of Polysilicon for MEMS Post-Fabrication Processing

Daphne Joachim, Liwei Lin
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 37-42, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0243
https://doi.org/10.1115/IMECE1999-0243
View Paper titled, Localized Deposition of Polysilicon for MEMS Post-Fabrication Processing
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Topics: Manufacturing, Microelectromechanical systems, Polysilicon, Microbeams, Finite element analysis, Sealing (Process), Silicon, Temperature
Proceedings Papers

Implementation and Analysis of Polymeric Replication by Micro-Injection Molding

Jatan Shah, Yu-Chuan Su, Liwei Lin
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 295-301, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0283
https://doi.org/10.1115/IMECE1999-0283
View Paper titled, Implementation and Analysis of Polymeric Replication by Micro-Injection Molding
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Topics: Molding, Injection molding, Microelectromechanical systems, Cavities, Cycles, Manufacturing, Microfabrication, Optimization, Polymer melts, Process control
Proceedings Papers

A Stiction Study via C-V Plot Electrostatic Actuation/Latching

Gary O’Brien, Liwei Lin, David J. Monk
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 275-281, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0280
https://doi.org/10.1115/IMECE1999-0280
View Paper titled, A Stiction Study via C-V Plot Electrostatic Actuation/Latching
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Topics: Stiction, Adhesion, Polysilicon, Elastic constants, Surface energy, Actuators, Capacitance, Capacitors, Microscale devices
Proceedings Papers

MEMS Curriculum Development in Mechanical Engineering at the University of Michigan

Liwei Lin
Proc. ASME. IMECE99, Mechanical Engineering Design Education: Issues and Case Studies, 51-54, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0640
https://doi.org/10.1115/IMECE1999-0640
View Paper titled, MEMS Curriculum Development in Mechanical Engineering at the University of Michigan
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Topics: Mechanical engineering, Microelectromechanical systems, Graduate students, Students, Undergraduate students, Electrical engineering, Finishes
Proceedings Papers

Design of MEMS Resonators for Tuning With Selective Polysilicon Deposition

Daphne Joachim, Liwei Lin
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 175-180, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23825
https://doi.org/10.1115/IMECE2001/MEMS-23825
View Paper titled, Design of MEMS Resonators for Tuning With Selective Polysilicon Deposition
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Topics: Design, Microelectromechanical systems, Polysilicon, Electromagnetic scattering, Engineering simulation, Finite element analysis, Manufacturing, Micromachining, Resonance, Rotors
Proceedings Papers

Zinc Bonding for MEMS Packaging at the Wafer-Level

Ki Bang Lee, Liwei Lin
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 707-710, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23899
https://doi.org/10.1115/IMECE2001/MEMS-23899
View Paper titled, Zinc Bonding for MEMS Packaging at the Wafer-Level
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Topics: Bonding, MEMS packaging, Microelectromechanical systems, Semiconductor wafers, Nickel, Cavities, Fracture (Materials), Fracture (Process), Fracture toughness, Manufacturing
Proceedings Papers

Selective Induction Heating for MEMS Packaging and Fabrication

Andrew Cao, Liwei Lin
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 763-767, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23908
https://doi.org/10.1115/IMECE2001/MEMS-23908
View Paper titled, Selective Induction Heating for MEMS Packaging and Fabrication
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Topics: Electromagnetic induction, Heating, Manufacturing, MEMS packaging, Microelectromechanical systems, Aluminum, Heat, Bonding, Borosilicate glasses, Design
Proceedings Papers

MEMS Post-Packaging by Localized Heating

Liwei Lin
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 629-635, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1156
https://doi.org/10.1115/IMECE2000-1156
View Paper titled, MEMS Post-Packaging by Localized Heating
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Topics: Heating, Microelectromechanical systems, Packaging, Bonding, Chemical vapor deposition, Silicon, Glass, MEMS packaging, Pressure, Sealing (Process)
Proceedings Papers

MEMS Flip-Up Micro-Coil Inductors

Gary O’Brien, David J. Monk, Liwei Lin
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 349-353, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1115
https://doi.org/10.1115/IMECE2000-1115
View Paper titled, MEMS Flip-Up Micro-Coil Inductors
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Topics: Inductors, Microelectromechanical systems, Manufacturing, Polysilicon, Integrated circuits, Micromachining, Needles, Probes, Semiconductor wafers
Proceedings Papers

Electrostatic Latch and Release: A Theoretical and Empirical Study

Gary J. O’Brien, David J. Monk, Liwei Lin
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 19-26, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1065
https://doi.org/10.1115/IMECE2000-1065
View Paper titled, Electrostatic Latch and Release: A Theoretical and Empirical Study
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Topics: Actuators, Cantilever beams, Cantilevers, Capacitance, Deflection, Displacement, Electric fields, Electrostatic actuators, Euler-Bernoulli beam theory, Microelectromechanical systems
Proceedings Papers

Micro-to-Macro Fluidic Interconnectors With an Integrated Polymer Sealant

Jr-Hung Tsai, Liwei Lin
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 419-423, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1125
https://doi.org/10.1115/IMECE2000-1125
View Paper titled, Micro-to-Macro Fluidic Interconnectors With an Integrated Polymer Sealant
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Topics: Polymers, Sealants, Leakage, Microfluidics, Gates (Closures), Manufacturing, Microchannels, Polyester film, Pressure, Sealing (Process)
Proceedings Papers

Transient Bubble Formation on a Polysilicon Micro Resister

Jr-Hung Tsai, Liwei Lin
Proc. ASME. IMECE2000, Heat Transfer: Volume 2, 251-258, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1434
https://doi.org/10.1115/IMECE2000-1434
View Paper titled, Transient Bubble Formation on a Polysilicon Micro Resister
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Topics: Bubbles, Polysilicon, Transients (Dynamics), Heating, Wall temperature, Nucleation (Physics), Temperature, Evaporation, Heat transfer coefficients, Transducers
Proceedings Papers

Residual Stress Analysis of Silicon-Aluminum-Glass Bonding Processes

Delney Bystrom, Liwei Lin
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 45-50, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39269
https://doi.org/10.1115/IMECE2002-39269
View Paper titled, Residual Stress Analysis of Silicon-Aluminum-Glass Bonding Processes
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Topics: Aluminum, Bonding, Glass, Silicon, Stress analysis (Engineering), Quartz, Borosilicate glasses, Fracture (Materials), Fracture toughness, Stress
Proceedings Papers

Design and Fabrication of an Annular High Frequency Resonator

Ki Bang Lee, Steve Ryder, Chih-Chen Lee, Liwei Lin
Proc. ASME. IMECE2002, Microelectromechanical Systems, 355-358, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-33387
https://doi.org/10.1115/IMECE2002-33387
View Paper titled, Design and Fabrication of an Annular High Frequency Resonator
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Topics: Design, Filters, Geometry, Manufacturing, Materials properties, Microelectromechanical systems, Micromachining, Mode shapes, Polysilicon, Resonance
Proceedings Papers

Surface Tension Propelled Microboats

Ki Bang Lee, Firas Sammoura, Liwei Lin
Proc. ASME. IMECE2004, Microelectromechanical Systems, 481-485, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-60680
https://doi.org/10.1115/IMECE2004-60680
View Paper titled, Surface Tension Propelled Microboats
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Topics: Surface tension, Fuels, Design, Drops, Microelectromechanical systems, Micromachining, Military systems, Surveillance, Water
Proceedings Papers

Rapid Low Temperature Bonding of Silicon to Steel for MEMS Sensors

Andrew Cao, Brian Sosnowchik, Liwei Lin, Albert Pisano
Proc. ASME. IMECE2004, Microelectromechanical Systems, 5-11, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-60683
https://doi.org/10.1115/IMECE2004-60683
View Paper titled, Rapid Low Temperature Bonding of Silicon to Steel for MEMS Sensors
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Topics: Bonding, Low temperature, Microelectromechanical systems, Sensors, Silicon, Steel, Corrosion resistance, Cycles, Damage, Failure