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L. C. Chang
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Proceedings Papers

Investigation of the Lead-On-Chip Package’s Reliability

P.-H. Tsao, L. C. Chang, T. C. Chen, Chender Haung, C. Z. Chen
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 347-351, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1109
https://doi.org/10.1115/IMECE1997-1109
View Paper titled, Investigation of the Lead-On-Chip Package’s Reliability
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Topics: Reliability, Epoxy adhesives, Epoxy resins, Silicon chips, Crack propagation, Failure mechanisms, Finite element analysis, Fracture (Materials), Manufacturing, Molding
Journal Articles

A Sustainability Strategy Assessment Framework Model for Medical Tourism Supply Chain in Asia

K.-C. Chung, L.-C. Chang
Journal: Journal of Testing and Evaluation
Publisher: ASTM International
Article Type: Technical Papers
J. Test. Eval.. March 2018, 46(2): 745–755.
Paper No: JTE20160424
https://doi.org/10.1520/JTE20160424
Published Online: March 1, 2018
View Article titled, A Sustainability Strategy Assessment Framework Model for Medical Tourism Supply Chain in Asia
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Proceedings Papers

Microstructure and Magnetic Properties of NdFeB Based Nanocomposites to Shock Compression

Jin-Chein Lin, M. H. Nien, L. C. Chang
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1849-1855, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73230
https://doi.org/10.1115/IPACK2005-73230
View Paper titled, Microstructure and Magnetic Properties of NdFeB Based Nanocomposites to Shock Compression
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Topics: Compression, Magnetic alloys, Nanocomposites, Shock (Mechanics)
Proceedings Papers

Measurement of Transverse Deflection for Composite Laminates Using Holographic Interferometry

Jin-Chein Lin, T. Y. Yang, L. C. Chang
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 191-195, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35261
https://doi.org/10.1115/IPACK2003-35261
View Paper titled, Measurement of Transverse Deflection for Composite Laminates Using Holographic Interferometry
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Topics: Composite materials, Deflection, Holographic interferometry, Laminates
Journal Articles

Investigation of the Lead-On-Chip Package’s Reliability

P.-H. Tsao, L. C. Chang, T. C. Chen, C. Haung, C. Z. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 171–174.
https://doi.org/10.1115/1.2792613
Published Online: June 1, 1998
View Article titled, Investigation of the Lead-On-Chip Package’s Reliability
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Topics: Reliability, Epoxy adhesives, Epoxy resins, Silicon chips, Crack propagation, Failure mechanisms, Finite element analysis, Fracture (Materials), Manufacturing, Molding
Journal Articles

Radiation-Natural Convection Interactions in Two-Dimensional Complex Enclosures

L. C. Chang, K. T. Yang, J. R. Lloyd
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1983, 105(1): 89–95.
https://doi.org/10.1115/1.3245564
Published Online: February 1, 1983
View Article titled, Radiation-Natural Convection Interactions in Two-Dimensional Complex Enclosures
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Topics: Convection, Radiation (Physics), Carbon dioxide, Ceilings, Gases, Heat transfer, Temperature