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Jianhua Zhang
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Journal Articles

A Novel Design Method for the Knee Joint of the Exoskeleton Based on the Modular Wearable Sensor

Jian Cao, Chang Wang, Jianhua Zhang, Kexiang Li, Jianjun Zhang
Journal: Journal of Medical Devices
Publisher: ASME
Article Type: Research-Article
J. Med. Devices. December 2023, 17(4): 041002.
Paper No: MED-23-1056
https://doi.org/10.1115/1.4063672
Published Online: October 26, 2023
View Article titled, A Novel Design Method for the Knee Joint of the Exoskeleton Based on the Modular Wearable Sensor
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Topics: Design, Exoskeleton devices, Knee, Trajectories (Physics)
Proceedings Papers

Fluid-Structure Interaction Analysis of a Peristaltic Pump by Using Numerical and Experimental Methods

Qingye Li, Chaoyong Zong, Jianhua Zhang, Yanfeng Zhang, Xueguan Song
Proc. ASME. PVP2022, Volume 3: Fluid-Structure Interaction; High Pressure Technology, V003T04A012, July 17–22, 2022
Publisher: American Society of Mechanical Engineers
Paper No: PVP2022-84409
https://doi.org/10.1115/PVP2022-84409
View Paper titled, Fluid-Structure Interaction Analysis of a Peristaltic Pump by Using Numerical and Experimental Methods
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Topics: Computer simulation, Elasticity, Experimental methods, Fluid structure interaction, Pumps
Journal Articles

Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis

Yanyi Xiao, Wen Wang, Jianhua Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021006.
Paper No: EP-15-1051
https://doi.org/10.1115/1.4033106
Published Online: April 15, 2016
View Article titled, Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis
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Topics: Bonding, Glass, Lasers, Temperature, Temperature distribution, Fittings, Sealing (Process)
Journal Articles

Filter-Based Fault Diagnosis of Wind Energy Conversion Systems Subject to Sensor Faults

Jianhua Zhang, Jing Xiong, Mifeng Ren, Yuntao Shi, Jinliang Xu
Journal: Journal of Dynamic Systems, Measurement, and Control
Publisher: ASME
Article Type: Research-Article
J. Dyn. Sys., Meas., Control. June 2016, 138(6): 061008.
Paper No: DS-15-1195
https://doi.org/10.1115/1.4032827
Published Online: April 1, 2016
View Article titled, Filter-Based Fault Diagnosis of Wind Energy Conversion Systems Subject to Sensor Faults
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Topics: Filters, Sensors, Errors, Fault diagnosis
Proceedings Papers

Ship Impact Behavior on Jacket Type Offshore Wind Turbine Foundation

Jianhua Zhang, Dianwei Gao, Ke Sun, Zhiyang Zhang
Proc. ASME. OMAE2014, Volume 4B: Structures, Safety and Reliability, V04BT02A040, June 8–13, 2014
Publisher: American Society of Mechanical Engineers
Paper No: OMAE2014-24578
https://doi.org/10.1115/OMAE2014-24578
View Paper titled, Ship Impact Behavior on Jacket Type Offshore Wind Turbine Foundation
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Topics: Offshore wind turbines, Ships, Collisions (Physics), Ocean engineering, Accidents, Damage, Dynamic analysis, Engineering design, Offshore structures, Seas
Proceedings Papers

Numerical Investigation of Pressure Fluctuation on the Volute of a Backward Curved Blade Centrifugal Fan

Jianhua Zhang, Wuli Chu, Yanhui Wu, Haoguang Zhang, Xingjie Dong
Proc. ASME. GT2014, Volume 1A: Aircraft Engine; Fans and Blowers, V01AT10A010, June 16–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: GT2014-25707
https://doi.org/10.1115/GT2014-25707
View Paper titled, Numerical Investigation of Pressure Fluctuation on the Volute of a Backward Curved Blade Centrifugal Fan
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Topics: Blades, Pressure, Fluctuations (Physics), Flow (Dynamics), Impellers, Unsteady flow, Engineering simulation, Noise (Sound), Simulation, Vibration
Proceedings Papers

FEM Analysis on Damage Layer in Wire Saw Cutting Single Crystal Silicon

Jianhua Zhang, Xiaojun Zhang, Tien-Chien Jen, Jiafu Liu, Yi-Hsin Yen
Proc. ASME. IMECE2010, Volume 3: Design and Manufacturing, Parts A and B, 899-903, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-37328
https://doi.org/10.1115/IMECE2010-37328
View Paper titled, FEM Analysis on Damage Layer in Wire Saw Cutting Single Crystal Silicon
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Topics: Crystals, Cutting, Damage, Finite element methods, Silicon, Wire, Semiconductor wafers, Diamonds, Integrated circuits, Shear stress
Proceedings Papers

Axiomatic Design of a Multi-Directional Motion Pin on Disk Apparatus for Biotribology Study

Zikai Hua, Jianhua Zhang
Proc. ASME. IJTC2010, STLE/ASME 2010 International Joint Tribology Conference, 37-39, October 17–20, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2010-41039
https://doi.org/10.1115/IJTC2010-41039
View Paper titled, Axiomatic Design of a Multi-Directional Motion Pin on Disk Apparatus for Biotribology Study
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Topics: Biotribology, Design, Disks, Wear, Adhesives, Artificial limbs, Control systems, Molecular weight, Pins (Engineering), Polishing
eBook Chapter

Optimal Robustness of Scale-Free Networks

Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2011
https://doi.org/10.1115/1.859742.paper34
ISBN: 9780791859742
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Topics: Robustness
Proceedings Papers

Design and Structural Analysis of Mono Pile Foundation for Offshore Wind Turbines

Jianhua Zhang, Zhenqing Wang, Liang Zhang, Ke Sun, Jun Hao
Proc. ASME. OMAE2010, 29th International Conference on Ocean, Offshore and Arctic Engineering: Volume 2, 541-547, June 6–11, 2010
Publisher: American Society of Mechanical Engineers
Paper No: OMAE2010-20750
https://doi.org/10.1115/OMAE2010-20750
View Paper titled, Design and Structural Analysis of Mono Pile Foundation for Offshore Wind Turbines
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Topics: Design, Offshore wind turbines, Pilings (Building), Structural analysis, Stress, China, Deformation, Ocean engineering, Seabed, Wind turbines
Journal Articles

Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film

Jianhua Zhang, Jinsong Zhang, Lianqiao Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2010, 132(4): 044501.
https://doi.org/10.1115/1.4002898
Published Online: December 3, 2010
View Article titled, Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film
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Topics: Bonding, Contact resistance, Packaging, Tin, Temperature, Pressure, Glass, High temperature, Melting point
Proceedings Papers

Investigation of Heat Pipe Cooling in Drilling Applications: Part 2—Thermal, Structural Static, and Dynamic Analyses

Lin Zhu, Tien-Chien Jen, Chen-Long Yin, Yi-Hsin Yen, Mei Zhu, Jianhua Zhang
Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 2027-2034, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-10314
https://doi.org/10.1115/IMECE2009-10314
View Paper titled, Investigation of Heat Pipe Cooling in Drilling Applications: Part 2—Thermal, Structural Static, and Dynamic Analyses
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Topics: Cooling, Drilling, Dynamic analysis, Heat pipes, Drills (Tools), Coolants, Cutting, Temperature, Wear, Contamination
Proceedings Papers

Structural Design of a Silicon Six-Wafer Micro-Combustor Under the Effect of Hydrogen/Air Ratio

Lin Zhu, Tien-Chien Jen, Chen-Long Yin, Mei Zhu, Yi-Hsin Yen, Jianhua Zhang
Proc. ASME. IMECE2009, Volume 3: Combustion Science and Engineering, 361-369, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-10315
https://doi.org/10.1115/IMECE2009-10315
View Paper titled, Structural Design of a Silicon Six-Wafer Micro-Combustor Under the Effect of Hydrogen/Air Ratio
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Topics: Combustion chambers, Hydrogen, Semiconductor wafers, Silicon, Structural design, Temperature, Combustion, Computational fluid dynamics, Design, Flames
Journal Articles

Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film

Jianhua Zhang, Fang Yuan, Jinsong Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041008.
https://doi.org/10.1115/1.4000361
Published Online: October 29, 2009
View Article titled, Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film
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Topics: Bonding, Warping, Glass, Temperature
Proceedings Papers

Experimental Study on Running-In of Steel Gear Pairs With Micro- and Nano-Materials

Zegui Wang, Xiaopeng Xie, Jianhua Zhang
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 629-634, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21121
https://doi.org/10.1115/MNC2007-21121
View Paper titled, Experimental Study on Running-In of Steel Gear Pairs With Micro- and Nano-Materials
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Topics: Gears, Nanomaterials, Steel, Wear
Proceedings Papers

Investigation of New Bionic Therapeutic Lubricants

Jianhua Zhang, Zikai Hua, Shihu Su
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 943-945, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44095
https://doi.org/10.1115/IJTC2007-44095
View Paper titled, Investigation of New Bionic Therapeutic Lubricants
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Topics: Bionics, Lubricants, Artificial joints, Membranes, Tribology, Wear, Biocompatibility, Biomedicine, Boundary lubrication, Film thickness
Proceedings Papers

Development of a New Tribological Multi-Function Simulator

Zikai Hua, Jianhua Zhang, Ke Xue
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 947-949, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44142
https://doi.org/10.1115/IJTC2007-44142
View Paper titled, Development of a New Tribological Multi-Function Simulator
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Topics: Tribology, Computers, Control systems, Design, Friction, Hip joint prostheses, Pins (Engineering), Rotation, Wear testing