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J. F. J. M. Caers
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Proceedings Papers

Effect of Moisture on Durability of Flip-Chip-on-Board (FCOB) Interconnects

J. H. Okura, A. Dasgupta, J. F. J. M. Caers
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 145-151, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2256
https://doi.org/10.1115/IMECE2000-2256
View Paper titled, Effect of Moisture on Durability of Flip-Chip-on-Board (FCOB) Interconnects
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Topics: Durability, Failure mechanisms, Absorption, Cracking (Materials), Diffusion (Physics), Engineering simulation, Finite element analysis, Fracture (Process), Intermetallic compounds, Life testing
Proceedings Papers

Development of Integrated Process-Ageing Modeling Methodology for Flip Chip on Flex Interconnections With Non-Conductive Adhesives

Xiaowu Zhang, E. H. Wong, Ranjan Rajoo, Mahadevan K. Iyer, J. F. J. M. Caers, X. J. Zhao
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 849-856, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73020
https://doi.org/10.1115/IPACK2005-73020
View Paper titled, Development of Integrated Process-Ageing Modeling Methodology for Flip Chip on Flex Interconnections With Non-Conductive Adhesives
Open the PDF for Development of Integrated Process-Ageing Modeling Methodology for Flip Chip on Flex Interconnections With Non-Conductive Adhesives in another window
Topics: Adhesives, Flip-chip, Flip-chip devices, Modeling, Stress, Finite element analysis, Finite element model, Reliability, Temperature, Thermomechanics
Proceedings Papers

Characterization of Non-Conductive Adhesives

Daniel Farley, Abhijit Dasgupta, J. F. J. M. Caers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1365-1370, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73021
https://doi.org/10.1115/IPACK2005-73021
View Paper titled, Characterization of Non-Conductive Adhesives
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Topics: Adhesives, Manufacturing, Stress, Metals, Modeling, Contact resistance, Simulation, Temperature, Bonding, Compression
Journal Articles

Solders Fatigue Prediction Using Interfacial Boundary Volume Criterion

X. J. Zhao, G. Q. Zhang, J. F. J. M. Caers, L. J. Ernst
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 582–588.
https://doi.org/10.1115/1.1604160
Published Online: December 15, 2003
View Article titled, Solders Fatigue Prediction Using Interfacial Boundary Volume Criterion
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Topics: Deformation, Fatigue, Fatigue life, Solder joints, Solders, Modeling, Damage, Cycles, Packaging
Journal Articles

Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects

J. H. Okura, A. Dasgupta, J. F. J. M. Caers
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 184–187.
https://doi.org/10.1115/1.1477193
Published Online: July 26, 2002
View Article titled, Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects
Open the PDF for Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects in another window
Topics: Durability, Intermetallic compounds, Stress, Finite element analysis, Life testing, Solder joints, Failure, Temperature
Journal Articles

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill

K. Darbha, J. H. Okura, S. Shetty, A. Dasgupta, T. Reinikainen, J. Zhu, J. F. J. M. Caers
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 237–241.
https://doi.org/10.1115/1.2793846
Published Online: December 1, 1999
View Article titled, Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill
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Topics: Durability, Flip-chip, Flip-chip devices, Solders, Thermomechanics, Fatigue, Finite element model, Solder joints, Architecture, Cycles