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Proceedings Papers

Laser Ultrasonic Sensing of Penetration Depth in Robotic Welding: Simulated Solidified Welds

George M. Graham, I. Charles Ume
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 55-62, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0775
https://doi.org/10.1115/IMECE1996-0775
View Paper titled, Laser Ultrasonic Sensing of Penetration Depth in Robotic Welding: Simulated Solidified Welds
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Topics: Lasers, Robotic welding, Welded joints, Acoustics, Control systems, Design, Fibers, Maintenance, Real-time control, Sensors
Proceedings Papers

Thermomechanical Stress Analyses of Plated-Through Holes in PWB Using Internal State Variable Constitutive Models

Chiayu Fu, I. Charles Ume, David L. McDowell
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 65-72, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0891
https://doi.org/10.1115/IMECE1996-0891
View Paper titled, Thermomechanical Stress Analyses of Plated-Through Holes in PWB Using Internal State Variable Constitutive Models
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Topics: Constitutive equations, Printed circuit boards, Stress analysis (Engineering), Thermomechanics, Fatigue, Fatigue cracks, Stress, Temperature, Thermal stresses, Copper
Proceedings Papers

Comparison of First-Order Shear and Plane Strain Assumptions in Warpage of Simply Supported Printed Wiring Boards

Yarom Polsky, I. Charles Ume
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 789-794, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1093
https://doi.org/10.1115/IMECE1998-1093
View Paper titled, Comparison of First-Order Shear and Plane Strain Assumptions in Warpage of Simply Supported Printed Wiring Boards
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Topics: Plane strain, Printed circuit boards, Shear (Mechanics), Warping, Deflection, Temperature, Lamination, Materials properties, Mechanical properties, Modeling
Proceedings Papers

Design of Laser Ultrasonic System for In-Process Weld Penetration Monitoring and Control

Sandra N. Hopko, I. Charles Ume, Dathan S. Erdahl
Proc. ASME. IMECE99, Manufacturing Science and Engineering, 659-668, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0727
https://doi.org/10.1115/IMECE1999-0727
View Paper titled, Design of Laser Ultrasonic System for In-Process Weld Penetration Monitoring and Control
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Topics: Design, Lasers, Fibers, Optical fiber, Ablation (Vaporization technology), Inspection, High temperature, Nondestructive evaluation, Probes, Testing
Proceedings Papers

In-Situ Warpage Measurement During Thermal Cycling of Dielectric Coated SS Substrate for Large Area MCM-D Packaging

Anh X. H. Dang, I. Charles Ume, Swapan K. Bhattacharya
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 169-179, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0930
https://doi.org/10.1115/IMECE1999-0930
View Paper titled, In-Situ Warpage Measurement During Thermal Cycling of Dielectric Coated SS Substrate for Large Area MCM-D Packaging
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Topics: Packaging, Warping, Dielectric materials, Lasers, Stainless steel, Temperature, Thin films, Vehicles
Proceedings Papers

Warpage Analysis of Wafers With Film Coating

Hai Ding, I. Charles Ume, Cheng Zhang
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 1-7, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24700
https://doi.org/10.1115/IMECE2001/EPP-24700
View Paper titled, Warpage Analysis of Wafers With Film Coating
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Topics: Coating processes, Coatings, Semiconductor wafers, Warping, Finite element analysis, Packaging, Shades and shadows, Young's modulus, Delamination, Design
Proceedings Papers

Development of Undergraduate Mechatronics Course in the School of Mechanical Engineering at Georgia Tech

I. Charles Ume, Akio Kita
Proc. ASME. IMECE2001, Mechanical Engineering Design Education: Issues and Case Studies, 31-35, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/DE-23284
https://doi.org/10.1115/IMECE2001/DE-23284
View Paper titled, Development of Undergraduate Mechatronics Course in the School of Mechanical Engineering at Georgia Tech
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Topics: Mechanical engineering, Mechatronics education, Undergraduate students, Students, Mechatronics, Engineering education
Proceedings Papers

Vibration Analysis Based Modeling and Defect Recognition for Flip Chip Solder Joint Inspection

Sheng Liu, Dathan Erdahl, I. Charles Ume
Proc. ASME. IMECE2000, Manufacturing Engineering, 405-412, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1835
https://doi.org/10.1115/IMECE2000-1835
View Paper titled, Vibration Analysis Based Modeling and Defect Recognition for Flip Chip Solder Joint Inspection
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Topics: Flip-chip, Flip-chip devices, Inspection, Modeling, Solder joints, Vibration analysis, Vibration, Oscillating frequencies, Solders, Ball-Grid-Array packaging
Proceedings Papers

Application of a Novel Flip Chip Solder Joint Inspection System to Chips on an FR-4 Substrate

Dathan S. Erdahl, Sheng Liu, I. Charles Ume
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 189-195, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2262
https://doi.org/10.1115/IMECE2000-2262
View Paper titled, Application of a Novel Flip Chip Solder Joint Inspection System to Chips on an FR-4 Substrate
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Topics: Flip-chip devices, Inspection, Solder joints, Solders, Vibration, Ball-Grid-Array packaging, Lasers, Ultrasound, Displacement, Interferometers
Journal Articles

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

Sungbum Kang, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031007.
Paper No: EP-13-1074
https://doi.org/10.1115/1.4027425
Published Online: May 12, 2014
View Article titled, Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods
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Topics: Diffraction gratings, Lasers, Resolution (Optics), Warping, Printed circuit boards, Accuracy and precision
Proceedings Papers

Quality Evaluation of Solder Bump in PBGA Package for Commercial Product Application Using Laser Ultrasonic Technique

Jie Gong, I. Charles Ume, Kola Akinade, Amiya Ray Chaudhuri
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A084, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-66484
https://doi.org/10.1115/IMECE2013-66484
View Paper titled, Quality Evaluation of Solder Bump in PBGA Package for Commercial Product Application Using Laser Ultrasonic Technique
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Topics: Lasers, Solders, Natural language interfaces, Displacement, Transients (Dynamics), Ultrasound, Ball-Grid-Array packaging, Capacitors, Flip-chip devices, Inspection
Proceedings Papers

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

Sungbum Kang, I. Charles Ume
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A081, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-65072
https://doi.org/10.1115/IMECE2013-65072
View Paper titled, Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods
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Topics: Lasers, Warping, Printed circuit boards, Manufacturing, Reliability, Resolution (Optics), Accuracy and precision, Density, Electronic packages, Thermomechanics
Proceedings Papers

Determination of Optimum Values of Control Parameters to Reduce Laser Speckle Noise for Projection Moire´ System

Sungbum Kang, Jie Gong, I. Charles Ume
Proc. ASME. IMECE2011, Volume 1: Advances in Aerospace Technology; Energy Water Nexus; Globalization of Engineering; Posters, 743-749, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-62766
https://doi.org/10.1115/IMECE2011-62766
View Paper titled, Determination of Optimum Values of Control Parameters to Reduce Laser Speckle Noise for Projection Moire´ System
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Topics: Laser speckle, Noise (Sound), Errors, Lasers, Noise control, Regression analysis, Design, Diffraction gratings, Displacement, Electronic packaging
Proceedings Papers

Investigation of Interaction of Laser Generated Lamb Waves With Structures of Interest

Lei Yang, I. Charles Ume
Proc. ASME. IMECE2011, Volume 3: Design and Manufacturing, 431-439, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-62972
https://doi.org/10.1115/IMECE2011-62972
View Paper titled, Investigation of Interaction of Laser Generated Lamb Waves With Structures of Interest
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Topics: Lasers, Waves, Signals, Nondestructive evaluation, Acoustics, Aluminum plate, Fourier transforms, Inspection, Transducers, Welded joints
Proceedings Papers

Void Inspection in Lead-Free Solder Bumps on Ball Grid Array (BGA) Packages Using Laser Ultrasound Technique

Jie Gong, I. Charles Ume
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 941-948, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-63147
https://doi.org/10.1115/IMECE2011-63147
View Paper titled, Void Inspection in Lead-Free Solder Bumps on Ball Grid Array (BGA) Packages Using Laser Ultrasound Technique
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Topics: Ball-Grid-Array packaging, Inspection, Lasers, Lead-free solders, Ultrasound, Solders, X-rays, Interferometers, Solder joints, Transients (Dynamics)
Proceedings Papers

Laser Ultrasonic Inspection of Solder Bumps in Flip Chip Packages Using Virtual Package Device as Reference

I. Charles Ume, Jie Gong, Razid Ahmad, Abel Valdes
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 507-516, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-39970
https://doi.org/10.1115/IMECE2010-39970
View Paper titled, Laser Ultrasonic Inspection of Solder Bumps in Flip Chip Packages Using Virtual Package Device as Reference
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Topics: Flip-chip packages, Inspection, Lasers, Solders, Signals, Vibration, Flip-chip devices, Interferometers, Manufacturing industry, Silicon
Proceedings Papers

Measurement of Weld Dimensions of Butt Joint Welding in Thin Plates Using Superimposed Laser Sources

Tsun-Yen Wu, I. Charles Ume
Proc. ASME. IMECE2010, Volume 3: Design and Manufacturing, Parts A and B, 549-561, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-38212
https://doi.org/10.1115/IMECE2010-38212
View Paper titled, Measurement of Weld Dimensions of Butt Joint Welding in Thin Plates Using Superimposed Laser Sources
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Topics: Dimensions, Lasers, Plates (structures), Welding, Waves, Gas metal arc welding, Signals, Wavelength, Reflectance, Welded joints
Proceedings Papers

Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique

Jie Gong, I. Charles Ume
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 95-103, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52294
https://doi.org/10.1115/IPACK2011-52294
View Paper titled, Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique
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Topics: Ball-Grid-Array packages, Lasers, Lead-free solders, Ultrasound, Wetting, Solders, Inspection, Transients (Dynamics), Ball-Grid-Array packaging, Displacement
Proceedings Papers

Detection of Defects in Welded Structures With Complex Geometry Using Statistical Method Based on Discrete Wavelet Transform

Tsun-Yen Wu, I. Charles Ume, Matthew D. Rogge
Proc. ASME. IMECE2009, Volume 4: Design and Manufacturing, 419-425, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-10831
https://doi.org/10.1115/IMECE2009-10831
View Paper titled, Detection of Defects in Welded Structures With Complex Geometry Using Statistical Method Based on Discrete Wavelet Transform
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Topics: Discrete wavelet transforms, Geometry, Inspection, Flaw detection, Signals, Acoustics, Sensors, Transducers, Ultrasound, Wavelets
Journal Articles

Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection System

Jin Yang, Lizheng Zhang, I. Charles Ume, Camil Ghiu, George White
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021006.
https://doi.org/10.1115/1.4001832
Published Online: June 23, 2010
View Article titled, Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection System
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Topics: Cycles, Inspection, Lasers, Reliability, Solder joints, Ultrasound, X-rays, Fracture (Materials)