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H. E. Fang
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Proceedings Papers

Failure Analysis of Miniature Solder Specimen

Y. Wei, C. L. Chow, H. E. Fang, M. K. Neilsen, T. J. Lim, W. Lu
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 243-249, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24731
https://doi.org/10.1115/IMECE2001/EPP-24731
View Paper titled, Failure Analysis of Miniature Solder Specimen
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Topics: Failure analysis, Solders, Damage, Engineering simulation, Simulation, Finite element analysis, Tension, ASTM International, ASTM standards, Constitutive equations
Proceedings Papers

Damage Mechanics Based Fatigue Life Prediction for 63Sn-37Pb Solder Material

Y. Wei, C. L. Chow, M. K. Neilsen, H. E. Fang
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 161-165, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2258
https://doi.org/10.1115/IMECE2000-2258
View Paper titled, Damage Mechanics Based Fatigue Life Prediction for 63Sn-37Pb Solder Material
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Topics: Damage mechanics, Fatigue life, Solders, Damage, Fatigue damage, Computer simulation, Failure
Proceedings Papers

Constitutive Model for Sn-Pb Solder Under Fatigue Loading

Y. Wei, C. L. Chow, M. K. Nielsen, H. E. Fang
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 199-205, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39186
https://doi.org/10.1115/IMECE2002-39186
View Paper titled, Constitutive Model for Sn-Pb Solder Under Fatigue Loading
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Topics: Constitutive equations, Fatigue, Solders, Tin, Alloys, Damage, Fatigue failure, Fatigue life, Materials degradation, Mechanical behavior
Journal Articles

Behavior of Lead-Free Solder Under Thermomechanical Loading

Y. Wei, C. L. Chow, K. J. Lau, P. Vianco, H. E. Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 367–373.
https://doi.org/10.1115/1.1773197
Published Online: October 6, 2004
View Article titled, Behavior of Lead-Free Solder Under Thermomechanical Loading
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Topics: Constitutive equations, Damage, Deformation, Finite element analysis, Lead-free solders, Solders, Stress, Temperature, Thermomechanics, Alloys
Journal Articles

Failure Analysis of Miniature Solder Specimen

Y. Wei, C. L. Chow, H. E. Fang, M. K. Neilsen, T. J. Lim, W. Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 100–105.
https://doi.org/10.1115/1.1648060
Published Online: April 30, 2004
View Article titled, Failure Analysis of Miniature Solder Specimen
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Topics: Damage, Failure analysis, Finite element analysis, Solders, Creep, Fatigue, Constitutive equations, Nonequilibrium thermodynamics, Stress, Displacement
Journal Articles

Phase Structure and Cyclic Deformation in Eutectic Tin-Lead Alloy: A Numerical Analysis

Y.-L. Shen, W. Li, H. E. Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 74–78.
https://doi.org/10.1115/1.1324673
Published Online: June 29, 2000
View Article titled, Phase Structure and Cyclic Deformation in Eutectic Tin-Lead Alloy: A Numerical Analysis
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Topics: Alloys, Deformation, Shear (Mechanics), Stress, Fatigue, Tin, Damage, Eutectic alloys, Cycles, Modeling
Journal Articles

Characteristics of Creep Damage for 60 Sn-40 Pb Solder Material

Y. Wei, C. L. Chow, H. E. Fang, M. K. Neilsen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 278–283.
https://doi.org/10.1115/1.1372319
Published Online: October 20, 1999
View Article titled, Characteristics of Creep Damage for 60 Sn-40 Pb Solder Material
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Topics: Creep, Damage, Solders, Tin, Stress