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G. Y. Masada
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Journal Articles

A Detailed Thermal Model of the Infrared Reflow Soldering Process

M. A. Eftychiou, T. L. Bergman, G. Y. Masada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 55–62.
https://doi.org/10.1115/1.2909302
Published Online: March 1, 1993
View Articletitled, A Detailed Thermal Model of the Infrared Reflow Soldering Process
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Topics: Reflow soldering, Heat conduction, Heat transfer, Mixed convection, Convection, Manufacturing, Ovens, Radiation (Physics), Solders, Temperature effects
Journal Articles

Confirmation of Creep and Fatigue Damage in Pb/Sn Solder Joints

A. I. Attarwala, J. K. Tien, G. Y. Masada, G. Dody
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 109–111.
https://doi.org/10.1115/1.2906405
Published Online: June 1, 1992
View Articletitled, Confirmation of Creep and Fatigue Damage in Pb/Sn Solder Joints
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Topics: Creep, Fatigue damage, Solder joints, Tin, Fatigue, Fracture (Materials), Solders, Crack propagation, Cracking (Materials), Cycles
Journal Articles

Thermal Effects During Infrared Solder Reflow—Part II: A Model of the Reflow Process

M. Eftychiou, T. L. Bergman, G. Y. Masada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 48–54.
https://doi.org/10.1115/1.2905441
Published Online: March 1, 1992
View Articletitled, Thermal Effects During Infrared Solder Reflow—Part II: A Model of the Reflow Process
Open the PDF for Thermal Effects During Infrared Solder Reflow—Part II: A Model of the Reflow Process in another window
Topics: Reflow soldering, Temperature effects, Engineering simulation, Manufacturing, Ovens, Radiative heat transfer, Simulation, Circuits, Computer simulation, Transient heat transfer
Journal Articles

Thermal Effects During Infrared Solder Reflow—Part I: Heat Transfer Mechanisms

N. J. Fernandes, T. L. Bergman, G. Y. Masada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 41–47.
https://doi.org/10.1115/1.2905440
Published Online: March 1, 1992
View Articletitled, Thermal Effects During Infrared Solder Reflow—Part I: Heat Transfer Mechanisms
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Topics: Heat transfer, Reflow soldering, Temperature effects, Ovens, Buoyancy, Computer simulation, Convection, Forced convection, Heating, Transients (Dynamics)
Journal Articles

The Extended Bond Graph Notation

M. E. Ingrim, G. Y. Masada
Journal: Journal of Dynamic Systems, Measurement, and Control
Publisher: ASME
Article Type: Research Papers
J. Dyn. Sys., Meas., Control. March 1991, 113(1): 113–117.
https://doi.org/10.1115/1.2896334
Published Online: March 1, 1991
View Articletitled, The Extended Bond Graph Notation
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Topics: Modeling, Tensors
Journal Articles

Extended Bond Graph Representation of the Traction Problem in Linear Elastodynamics

M. E. Ingrim, G. Y. Masada
Journal: Journal of Dynamic Systems, Measurement, and Control
Publisher: ASME
Article Type: Research Papers
J. Dyn. Sys., Meas., Control. March 1991, 113(1): 118–121.
https://doi.org/10.1115/1.2896335
Published Online: March 1, 1991
View Articletitled, Extended Bond Graph Representation of the Traction Problem in Linear Elastodynamics
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Topics: Elastodynamics, Traction, Approximation, Tensors, Elasticity, Finite element methods, Solid mechanics
Journal Articles

Simple Pressure and Energy State Equations for Lennard-Jones (12,6) Fluid

H. M. Paynter, E. P. Fahrenthold, G. Y. Masada
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1990, 112(1): 240–244.
https://doi.org/10.1115/1.2910352
Published Online: February 1, 1990
View Articletitled, Simple Pressure and Energy State Equations for Lennard-Jones (12,6) Fluid
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Topics: Energy levels (Quantum mechanics), Fluids, Pressure, Equations of state