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Eric Beyne
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Journal Articles

Edge Trimming Induced Defects on Direct Bonded Wafers

Fumihiro Inoue, Anne Jourdain, Lan Peng, Alain Phommahaxay, Daisuke Kosemura, Ingrid De Wolf, Kenneth June Rebibis, Andy Miller, Erik Sleeckx, Eric Beyne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031004.
Paper No: EP-17-1127
https://doi.org/10.1115/1.4040002
Published Online: May 11, 2018
View Article titled, Edge Trimming Induced Defects on Direct Bonded Wafers
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Topics: Damage, Grinding, Semiconductor wafers, Stress, Bonding
Journal Articles

Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding

Herman Oprins, Vladimir Cherman, Tomas Webers, Abdellah Salahouelhadj, Soon-Wook Kim, Lan Peng, Geert Van der Plas, Eric Beyne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011008.
Paper No: EP-16-1096
https://doi.org/10.1115/1.4035597
Published Online: January 10, 2017
View Article titled, Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding
Open the PDF for Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding in another window
Topics: Bonding, Semiconductor wafers, Thermal resistance, Transients (Dynamics), Temperature, Steady state
Journal Articles

Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages

Herman Oprins, Vladimir Cherman, Geert Van der Plas, Joeri De Vos, Eric Beyne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010902.
Paper No: EP-15-1090
https://doi.org/10.1115/1.4032346
Published Online: March 10, 2016
View Article titled, Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages
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Topics: Energy dissipation, Experimental characterization, Heat transfer, Heating, Thermal conductivity, Thermal resistance, Thermal analysis, Cooling, Temperature, Temperature profiles
Proceedings Papers

Experimental Characterization of the Vertical and Lateral Heat Transfer in 3D-SIC Packages

Herman Oprins, Vladimir Cherman, Geert Van der Plas, Joeri De Vos, Eric Beyne
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A068, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48316
https://doi.org/10.1115/IPACK2015-48316
View Paper titled, Experimental Characterization of the Vertical and Lateral Heat Transfer in 3D-SIC Packages
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Topics: Experimental characterization, Heat transfer, Complementary metal oxide semiconductors, Cooling, Epoxy adhesives, Epoxy resins, Heating, Thermal conductivity, Thermal properties, Thermal resistance
Proceedings Papers

An Efficient Bump Pad Design to Mitigate the Flip Chip Package Induced Stress

Mario Gonzalez, Joeri De Vos, Geert Van der Plas, Eric Beyne
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48111
https://doi.org/10.1115/IPACK2015-48111
View Paper titled, An Efficient Bump Pad Design to Mitigate the Flip Chip Package Induced Stress
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Topics: Design, Flip-chip packages, Stress, Copper, Columns (Structural), Polishing equipment, Solders, Finite element model, Flip-chip, Flip-chip devices
Journal Articles

The Shear Test as Interface Characterization Tool Applied to the Si-BCB Interface

Dominiek Degryse, Bart Vandevelde, Eric Beyne, Joris Degrieck
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041003.
https://doi.org/10.1115/1.4000209
Published Online: October 21, 2009
View Article titled, The Shear Test as Interface Characterization Tool Applied to the Si-BCB Interface
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Topics: Fracture (Materials), Shear (Mechanics), Modeling, Fracture mechanics
Journal Articles

Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies

Bart Vandevelde, Eric Beyne, Dirk Vandepitte, Martine Baelmans
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 351–358.
https://doi.org/10.1115/1.1772416
Published Online: October 6, 2004
View Article titled, Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies
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Topics: Flip-chip assemblies, Stress, Thermomechanics, Flip-chip devices, Deformation, Structural mechanics, Finite element model
Journal Articles

Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies

Bart Vandevelde, Eric Beyne, Kouchi (G.Q.) Zhang, Jo Caers, Dirk Vandepitte, Martine Baelmans
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 498–505.
https://doi.org/10.1115/1.1604150
Published Online: December 15, 2003
View Article titled, Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies
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Topics: Finite element analysis, Reliability, Simulation, Solder joints, Solders, Modeling, Thermomechanics, Sensitivity analysis, Design, Dimensions