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Proceedings Papers

Predicted Dynamic Strength and Durability of a Network Interface Unit (NIU) Enclosure

M. Uschitsky, E. Suhir, L. Shepherd, W. R. Lambert, M. A. Zimmerman
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 1-36, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0720
https://doi.org/10.1115/IMECE1996-0720
View Paper titled, Predicted Dynamic Strength and Durability of a Network Interface Unit (NIU) Enclosure
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Topics: Design, Durability, Dynamic response, Fracture (Materials), Fracture (Process), Reliability, Service life (Equipment), Shock (Mechanics), Stress, Structural analysis
Proceedings Papers

Finite Element Analysis of Optical Fiber Structures

B. R. Welker, M. Uschitsky, E. Suhir, S. Kher, G. Bubel
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 181-191, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0733
https://doi.org/10.1115/IMECE1996-0733
View Paper titled, Finite Element Analysis of Optical Fiber Structures
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Topics: Finite element analysis, Optical fiber, Stress, Composite materials, Computer software, Design, Epoxy adhesives, Geometry, Metals, Modeling
Proceedings Papers

Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner

M. Uschitsky, E. Suhir
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 67-100, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0724
https://doi.org/10.1115/IMECE1996-0724
View Paper titled, Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner
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Topics: Corners (Structural elements), Epoxy adhesives, Epoxy resins, Molding, Stress, Delamination, Adhesion, Fracture (Materials), Reliability, Design
Proceedings Papers

“Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: How Different Is Their Propensity to Moisture-Induced Failures?

E. Suhir, Q. S. M. Ilyas
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 101-125, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0725
https://doi.org/10.1115/IMECE1996-0725
View Paper titled, “Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: How Different Is Their Propensity to Moisture-Induced Failures?
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Topics: Failure, Membranes, Molding, Stress, Bending (Stress), Electronic packages, Structural analysis
Journal Articles

Analytical Modeling of Electronic and Photonic Materials Reliability: Perspective and Extension

E. Suhir
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. July 2023, 145(3): 031006.
Paper No: MATS-22-1129
https://doi.org/10.1115/1.4062085
Published Online: March 28, 2023
View Article titled, Analytical Modeling of Electronic and Photonic Materials Reliability: Perspective and Extension
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Topics: Design, Electronics, Manufacturing, Modeling, Reliability, Stress, Temperature, Physics, Photonics, Optical fiber
Proceedings Papers

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

M. Uschitsky, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 141-170, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0818
https://doi.org/10.1115/IMECE1997-0818
View Paper titled, Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles
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Topics: Diffusion (Physics), Epoxy adhesives, Epoxy resins, Molding, Particulate matter, Fillers (Materials), Stress, Weight (Mass), Electronic packaging, Indium compounds
Proceedings Papers

Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure

M. Uschitsky, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 33-54, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0813
https://doi.org/10.1115/IMECE1997-0813
View Paper titled, Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure
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Topics: Epoxy adhesives, Epoxy resins, Glass fibers, Stress, Fibers, Buckling, Delamination, Design, Metals, Optical fiber
Proceedings Papers

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, E. Suhir, G. W. Kammlott
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 171-206, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0819
https://doi.org/10.1115/IMECE1997-0819
View Paper titled, Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach
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Topics: Composite materials, Molding, Thermoelasticity, Fillers (Materials), Thermal stresses, Epoxy adhesives, Epoxy resins, Design, Integrated circuits, Reliability
Proceedings Papers

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

Y. Feng, V. R. Raju, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 89-139, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0817
https://doi.org/10.1115/IMECE1997-0817
View Paper titled, Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs
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Topics: Failure, Adhesion, Fracture mechanics, Manufacturing, Mechanical behavior, Microelectronic devices, Modeling, Molding, Reliability, Surfaces (Materials)
Journal Articles

Analysis of a Bow-Free Prestressed Test Specimen

E. Suhir, J. Nicolics
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Briefs
J. Appl. Mech. November 2014, 81(11): 114502.
Paper No: JAM-14-1309
https://doi.org/10.1115/1.4028551
Published Online: September 26, 2014
View Article titled, Analysis of a Bow-Free Prestressed Test Specimen
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Topics: Manufacturing, Stress, Cross section (Physics), Thermal stresses
Journal Articles

Predicted Thermal Stresses in a Trimaterial Assembly With Application to Silicon-Based Photovoltaic Module

E. Suhir, D. Shangguan, L. Bechou
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. March 2013, 80(2): 021008.
Paper No: JAM-12-1025
https://doi.org/10.1115/1.4007477
Published Online: January 22, 2013
View Article titled, Predicted Thermal Stresses in a Trimaterial Assembly With Application to Silicon-Based Photovoltaic Module
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Topics: Manufacturing, Stress, Shear stress
Journal Articles

Predicted Size of an Inelastic Zone in a Ball-Grid-Array Assembly

E. Suhir, L. Bechou, B. Levrier
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. March 2013, 80(2): 021007.
Paper No: JAM-12-1023
https://doi.org/10.1115/1.4007476
Published Online: January 22, 2013
View Article titled, Predicted Size of an Inelastic Zone in a Ball-Grid-Array Assembly
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Topics: Ball-Grid-Array packaging, Bonding, Manufacturing, Shear stress, Stress, Yield stress, Ceramics
Journal Articles

Predicted Thermal Stress in a Multileg Thermoelectric Module (TEM) Design

E. Suhir, A. Shakouri
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. March 2013, 80(2): 021012.
Paper No: JAM-12-1078
https://doi.org/10.1115/1.4007524
Published Online: January 22, 2013
View Article titled, Predicted Thermal Stress in a Multileg Thermoelectric Module (TEM) Design
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Topics: Design, Manufacturing, Shear stress, Stress, Thermal stresses
Journal Articles

Lattice-Misfit Stresses in a Circular Bi-Material Gallium-Nitride Assembly

E. Suhir
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Briefs
J. Appl. Mech. January 2013, 80(1): 014505.
Paper No: JAM-11-1481
https://doi.org/10.1115/1.4007104
Published Online: November 19, 2012
View Article titled, Lattice-Misfit Stresses in a Circular Bi-Material Gallium-Nitride Assembly
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Topics: Manufacturing, Shear stress, Stress, Gallium nitride
Journal Articles

Assembly Bonded at the Ends: Could Thinner and Longer Legs Result in a Lower Thermal Stress in a Thermoelectric Module Design?

E. Suhir, A. Shakouri
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. November 2012, 79(6): 061010.
https://doi.org/10.1115/1.4006597
Published Online: September 17, 2012
View Article titled, Assembly Bonded at the Ends: Could Thinner and Longer Legs Result in a Lower Thermal Stress in a Thermoelectric Module Design?
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Topics: Manufacturing, Shear stress, Stress
Journal Articles

Predicted Thermal Stresses in a Circular Assembly With Identical Adherends and With Application to a Holographic Memory Package Design

E. Suhir, C. Gu, L. Cao
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. January 2012, 79(1): 011011.
https://doi.org/10.1115/1.4005192
Published Online: December 13, 2011
View Article titled, Predicted Thermal Stresses in a Circular Assembly With Identical Adherends and With Application to a Holographic Memory Package Design
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Topics: Design, Manufacturing, Stress, Thermal stresses, Bonding
Journal Articles

Elastic Stability of a Cantilever Beam (Rod) Supported by an Elastic Foundation, With Application to Nano-Composites

E. Suhir
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. January 2012, 79(1): 011009.
https://doi.org/10.1115/1.4005190
Published Online: December 13, 2011
View Article titled, Elastic Stability of a Cantilever Beam (Rod) Supported by an Elastic Foundation, With Application to Nano-Composites
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Topics: Buckling, Cantilever beams, Elastic constants, Nanocomposites, Stability, Stiffness, Nanofibers, Temperature, Rods, Composite materials
Journal Articles

Predicted Response of the Die-Carrier Assembly in Flexible Electronics to the Combined Action of Tension and Bending Applied to the Carrier

E. Suhir
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. January 2012, 79(1): 011010.
https://doi.org/10.1115/1.4005191
Published Online: December 13, 2011
View Article titled, Predicted Response of the Die-Carrier Assembly in Flexible Electronics to the Combined Action of Tension and Bending Applied to the Carrier
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Topics: Manufacturing, Shear stress, Stress, Flexible electronics, Tension, Cross section (Physics)
Journal Articles

Predictive Modeling of the Dynamic Response of Electronic Systems to Shocks and Vibrations

E. Suhir
Journal: Applied Mechanics Reviews
Publisher: ASME
Article Type: Review Articles
Appl. Mech. Rev. September 2010, 63(5): 050803.
https://doi.org/10.1115/1.4003712
Published Online: March 23, 2011
View Article titled, Predictive Modeling of the Dynamic Response of Electronic Systems to Shocks and Vibrations
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Topics: Dynamic response, Electronic systems, Finite element analysis, Modeling, Shock (Mechanics), Stress, Vibration, Electronics
Journal Articles

Helicopter Landing Ship: Undercarriage Strength and the Role of the Human Factor

E. Suhir
Journal: Journal of Offshore Mechanics and Arctic Engineering
Publisher: ASME
Article Type: Safety And Reliability
J. Offshore Mech. Arct. Eng. February 2010, 132(1): 011603.
https://doi.org/10.1115/1.4000497
Published Online: December 22, 2009
View Article titled, Helicopter Landing Ship: Undercarriage Strength and the Role of the Human Factor
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Topics: Human factors, Probability, Ships