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Carlos Gutierrez
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Journal Articles

Detectability of Breast Cancer Through Inverse Heat Transfer Modeling Using Patient-Specific Surface Temperatures

Carlos Gutierrez, Satish G. Kandlikar
Journal: Journal of Engineering and Science in Medical Diagnostics and Therapy
Publisher: ASME
Article Type: Research-Article
ASME J of Medical Diagnostics. February 2025, 8(1): 011001.
Paper No: JESMDT-24-1008
https://doi.org/10.1115/1.4065797
Published Online: July 26, 2024
View Article titled, Detectability of Breast Cancer Through Inverse Heat Transfer Modeling Using Patient-Specific Surface Temperatures
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Topics: Cancer, Engines, Temperature, Tumors, Modeling, Algorithms, Shapes, Heat transfer, Heat
Journal Articles

A Transformative Approach for Breast Cancer Detection Using Physics-Informed Neural Network and Surface Temperature Data

Isaac Perez-Raya, Carlos Gutierrez, Satish Kandlikar
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2024, 146(10): 101201.
Paper No: HT-23-1456
https://doi.org/10.1115/1.4065673
Published Online: June 17, 2024
View Article titled, A Transformative Approach for Breast Cancer Detection Using Physics-Informed Neural Network and Surface Temperature Data
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Topics: Artificial neural networks, Cancer, Heat transfer, Modeling, Physics, Temperature, Tumors, Heat, Machine learning, Errors
Journal Articles

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Leila Choobineh, Robert Carrol, Carlos Gutierrez, Robert Geer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031106.
Paper No: EP-19-1098
https://doi.org/10.1115/1.4046848
Published Online: April 24, 2020
View Article titled, Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach
Open the PDF for Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach in another window
Topics: Bonding, Columns (Structural), Copper, Design, Gates (Closures), Manufacturing, Modeling, Semiconductor wafers, Silicon, Tiles
Proceedings Papers

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

Robert Carroll, Carlos Gutierrez, Leila Choobineh, Robert Geer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6514
https://doi.org/10.1115/IPACK2019-6514
View Paper titled, Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)
Open the PDF for Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) in another window
Topics: Gates (Closures), Manufacturing, Modeling, Temperature, Computer simulation, Delays, Density, Design, Dimensions, Energy consumption