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Proceedings Papers

Design and Analysis of a Meso-Scale Refrigerator

N. S. Ashraf, H. C. Carter, III, K. Casey, L. C. Chow, S. Corban, M. K. Drost, A. J. Gumm, Z. Hao, A. Q. Hasan, J. S. Kapat, L. Kramer, M. Newton, K. B. Sundaram, J. Vaidya, C. C. Wong, K. Yerkes
Proc. ASME. IMECE99, Heat Transfer: Volume 3, 109-116, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1068
https://doi.org/10.1115/IMECE1999-1068
View Paper titled, Design and Analysis of a Meso-Scale Refrigerator
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Topics: Design, Compression, Engines, Motors, Capacitance, Compressors, Electromagnetic induction, Electronics, Heat, Microelectronic devices
Proceedings Papers

Organic Monolayers for Low Temperature Copper – Gold Bonding

X. F. Ang, H. J. Lu, J. Wei, H. J. Zhang, C. C. Wong
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 281-284, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-38552
https://doi.org/10.1115/IMECE2010-38552
View Paper titled, Organic Monolayers for Low Temperature Copper – Gold Bonding
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Topics: Bonding, Copper, Low temperature, Bond strength, Chain, Coating processes, Coatings, Temperature
Proceedings Papers

Organic Monolayers for Room Temperature Copper Bonding

X. F. Ang, Q. H. Foo, J. Wei, Z. Chen, C. C. Wong
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 103-106, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-10557
https://doi.org/10.1115/IMECE2009-10557
View Paper titled, Organic Monolayers for Room Temperature Copper Bonding
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Topics: Bonding, Copper, Temperature, Bond strength, Coatings, Manufacturing, Microelectromechanical systems, Nanoelectromechanical systems, Semiconductor wafers, Stress
Proceedings Papers

Stability of Self-Assembled Monolayers on Gold for MEMS/NEMS Applications

X. F. Ang, A. T. Lin, J. Li, J. Wei, Z. Chen, C. C. Wong
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 5-10, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-66908
https://doi.org/10.1115/IMECE2008-66908
View Paper titled, Stability of Self-Assembled Monolayers on Gold for MEMS/NEMS Applications
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Topics: Microelectromechanical systems, Nanoelectromechanical systems, Self-assembly, Stability, Bonding, Biocompatibility, Biofouling, Biomedical microelectromechanical systems, Chain, Contamination
Proceedings Papers

Studies of Temperature and Pressure Dependence in Thermocompression Gold Joints

X. F. Ang, G. G. Zhang, J. Wei, Z. Chen, C. C. Wong
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 237-241, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-79454
https://doi.org/10.1115/IMECE2005-79454
View Paper titled, Studies of Temperature and Pressure Dependence in Thermocompression Gold Joints
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Topics: Pressure, Temperature, Bonding, Shear strength, Adhesives, Failure, Low temperature, Metal bonding, Packaging, Stress concentration
Journal Articles

Fatigue Properties of Microelectronics Solder Joints

N. Nir, T. D. Dudderar, C. C. Wong, A. R. Storm
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 92–101.
https://doi.org/10.1115/1.2905390
Published Online: June 1, 1991
View Article titled, Fatigue Properties of Microelectronics Solder Joints
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Topics: Fatigue properties, Microelectronic devices, Solder joints, Shear (Mechanics), Tin, Vehicles, Computers, Design, Engineering prototypes, Failure