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A. J. Rafanelli
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Journal Articles

Mechanical Analysis of Electronic Packaging Systems

Stephen A. McKeown,, Author, A. J. Rafanelli,, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2000, 122(1): 73.
https://doi.org/10.1115/1.483132
Published Online: March 1, 2000
View Article titled, Mechanical Analysis of Electronic Packaging Systems
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Topics: Electronic packaging, Engineering education, Integrated circuit packaging, Packaging
Journal Articles

A Review of Changes and Trends Affecting Military Electronics Manufacturing

A. J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 156–159.
https://doi.org/10.1115/1.2792608
Published Online: June 1, 1998
View Article titled, A Review of Changes and Trends Affecting Military Electronics Manufacturing
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Topics: Electronics, Manufacturing, Military systems, Defense industry, Aerospace industry, Coatings, Design, Proton exchange membranes
Journal Articles

Ramberg-Osgood Parameters for 63–37 Sn-Pb Solder

A. J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 234–238.
https://doi.org/10.1115/1.2906423
Published Online: June 1, 1992
View Article titled, Ramberg-Osgood Parameters for 63–37 Sn-Pb Solder
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Topics: Solders, Tin, Fracture toughness, Hardening, Stress, Work hardening
Journal Articles

Surface Mount Technology Materials, Processes, and Equipment

Carmen Capillo, Author, A. J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 1991, 113(2): 200.
https://doi.org/10.1115/1.2905388
Published Online: June 1, 1991
View Article titled, Surface Mount Technology Materials, Processes, and Equipment
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Topics: Surface mount technology
Journal Articles

Soldering in Electronics, Second Edition

R. J. Klein, Author, A. J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 1990, 112(2): 185–186.
https://doi.org/10.1115/1.2904362
Published Online: June 1, 1990
View Article titled, Soldering in Electronics, Second Edition
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Topics: Electronics, Soldering
Journal Articles

Solder Fillet Height Criteria for Surface Mounted Chip Components

A. J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 299–302.
https://doi.org/10.1115/1.3226551
Published Online: December 1, 1989
View Article titled, Solder Fillet Height Criteria for Surface Mounted Chip Components
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Topics: Solders, Capacitors, Ceramics, Solder joints, Thermal shock, Cycles, Fracture (Materials), Lumber, Navy, Tantalum