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A. A. O. Tay
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Journal Articles

A New Analytical Method for Calculating Maximum Junction Temperature of Packaged Devices Incorporating the Temperature Distribution at the Base of the Substrate

J. H. L. Ling, A. A. O. Tay
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2015, 137(1): 014502.
Paper No: EP-13-1133
https://doi.org/10.1115/1.4028120
Published Online: October 6, 2014
View Article titled, A New Analytical Method for Calculating Maximum Junction Temperature of Packaged Devices Incorporating the Temperature Distribution at the Base of the Substrate
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Topics: Temperature, Temperature distribution, Finite element analysis, Junctions, Heat
Journal Articles

A New Accurate Closed-Form Analytical Solution for Junction Temperature of High-Powered Devices

J. H. L. Ling, A. A. O. Tay
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011007.
Paper No: EP-13-1072
https://doi.org/10.1115/1.4026352
Published Online: January 16, 2014
View Article titled, A New Accurate Closed-Form Analytical Solution for Junction Temperature of High-Powered Devices
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Topics: Gates (Closures), Heat, Temperature, Temperature distribution, Junctions, Finite element analysis, Thermal conductivity
Journal Articles

Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element

A. A. O. Tay, K. H. Lee, K. M. Lim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 569–575.
https://doi.org/10.1115/1.1604803
Published Online: December 15, 2003
View Article titled, Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element
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Topics: Boundary element methods, Delamination, Fracture (Materials), Stress, Corners (Structural elements), Stress analysis (Engineering)
Journal Articles

Wirebond Deformation During Molding of IC Packages

A. A. O. Tay, K. S. Yeo, J. H. Wu, T. B. Lim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1995, 117(1): 14–19.
https://doi.org/10.1115/1.2792061
Published Online: March 1, 1995
View Article titled, Wirebond Deformation During Molding of IC Packages
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Topics: Deformation, Molding, Flow (Dynamics), Deflection, Transfer molding, Wire, Cavities, Circuits, Creeping flow, Dimensions