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A. Shakouri
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Journal Articles

Predicted Thermal Stress in a Multileg Thermoelectric Module (TEM) Design

E. Suhir, A. Shakouri
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. March 2013, 80(2): 021012.
Paper No: JAM-12-1078
https://doi.org/10.1115/1.4007524
Published Online: January 22, 2013
View Article titled, Predicted Thermal Stress in a Multileg Thermoelectric Module (TEM) Design
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Topics: Design, Manufacturing, Shear stress, Stress, Thermal stresses
Journal Articles

Assembly Bonded at the Ends: Could Thinner and Longer Legs Result in a Lower Thermal Stress in a Thermoelectric Module Design?

E. Suhir, A. Shakouri
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. November 2012, 79(6): 061010.
https://doi.org/10.1115/1.4006597
Published Online: September 17, 2012
View Article titled, Assembly Bonded at the Ends: Could Thinner and Longer Legs Result in a Lower Thermal Stress in a Thermoelectric Module Design?
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Topics: Manufacturing, Shear stress, Stress
Journal Articles

Transient Energy and Heat Transport in Metals: Effect of the Discrete Character of the Lattice

Y. Ezzahri, K. Joulain, A. Shakouri
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. July 2011, 133(7): 072401.
https://doi.org/10.1115/1.4003577
Published Online: April 5, 2011
View Article titled, Transient Energy and Heat Transport in Metals: Effect of the Discrete Character of the Lattice
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Topics: Density, Electrons, Metals, Oscillations, Temperature, Heat, Heat conduction, Electromagnetic scattering, Radiation scattering, Scattering (Physics)
Proceedings Papers

Analysing Transient Thermoreflectance Data Using Network Identification by Deconvolution

Y. Ezzahri, A. Shakouri
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 453-462, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89200
https://doi.org/10.1115/InterPACK2009-89200
View Paper titled, Analysing Transient Thermoreflectance Data Using Network Identification by Deconvolution
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Topics: Thermoreflectance, Transients (Dynamics), Excitation, Heat, Heating, Lasers, Systems analysis, Heat conduction, Heat flux, Probes
Proceedings Papers

Transient Energy and Heat Transport in Metals

Y. Ezzahri, A. Shakouri
Proc. ASME. HT2009, Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer, 217-226, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88280
https://doi.org/10.1115/HT2009-88280
View Paper titled, Transient Energy and Heat Transport in Metals
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Topics: Heat, Metals, Transients (Dynamics), Electromagnetic scattering, Electrons, Oscillations, Radiation scattering, Scattering (Physics), Dynamics (Mechanics), Fermi surfaces
Proceedings Papers

Optimization of Si/SiGe Microrefrigerators for Hybrid Solid-State/Liquid Cooling

Y. Ezzahri, R. Singh, J. Christofferson, Z. Bian, A. Shakouri
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 265-275, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33878
https://doi.org/10.1115/IPACK2007-33878
View Paper titled, Optimization of Si/SiGe Microrefrigerators for Hybrid Solid-State/Liquid Cooling
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Topics: Cooling, Optimization, Heat, Temperature, Heat conduction, Degrees of freedom, Engineering simulation, Integrated circuits, Junctions, Leakage
Proceedings Papers

Transient Thermal Characterization of ErAs/In 0.53 Ga 0.47 As Thermoelectric Module

Y. Ezzahri, R. Singh, K. Fukutani, Z. Bian, A. Shakouri, G. Zeng, J. E. Bowers, J. M. Zide, A. C. Gossard
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 277-281, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33880
https://doi.org/10.1115/IPACK2007-33880
View Paper titled, Transient Thermal Characterization of ErAs/In 0.53 Ga 0.47 As Thermoelectric Module
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Topics: Thermal characterization, Transients (Dynamics), Electrons, Nanoparticles, Semiconductors (Materials), Crystals, Electromagnetic scattering, Heat, Heat transfer, Metals
Journal Articles

Microscale and Nanoscale Thermal Characterization Techniques

J. Christofferson, K. Maize, Y. Ezzahri, J. Shabani, X. Wang, A. Shakouri
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
https://doi.org/10.1115/1.2993145
Published Online: November 13, 2008
View Article titled, Microscale and Nanoscale Thermal Characterization Techniques
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Topics: Imaging, Microscale devices, Nanoscale phenomena, Probes, Resolution (Optics), Temperature, Thermal characterization, Thermoreflectance, Wavelength, Atomic force microscopy
Journal Articles

Heat Transfer in Nanostructures for Solid-State Energy Conversion

G. Chen, Assoc. Prof. Mem. ASME, A. Shakouri
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Review Papers
J. Heat Mass Transfer. April 2002, 124(2): 242–252.
https://doi.org/10.1115/1.1448331
Published Online: November 20, 2001
View Article titled, Heat Transfer in Nanostructures for Solid-State Energy Conversion
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Topics: Electrons, Energy conversion, Heat transfer, Nanostructures , Phonons, Superlattices, Thermal conductivity, Temperature, Nanoscale phenomena, Thin films