Crack initiation and growth behavior in solder joints under cyclic shear deformation using piezomechanical actuation have been investigated. Experiments were conducted on specimens that consist of piezo–ceramic plates and eutectic Sn–Pb solder bonded in a double-lap shear configuration. Specimens were tested under various frequencies and ranges of applied electric field at room temperature, and a shear-lag model using elastic–perfectly plastic solder properties was developed to characterize the mechanical response of the solder joint. Nominal plastic shear strain ranges from 0.182% to 2.69% were considered. The applied shear strains measured using digital image correlation showed agreement with shear strains from analyses. The Coffin–Manson relationship was used to characterize crack initiation, and a power law was employed for crack growth. This work shows that the fatigue characteristics of solder joints using piezomechanical actuation exhibit reasonable agreement with those using other types of testing methods and provides the framework for a new accelerated testing methodology for solder joint reliability.
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January 2007
Technical Papers
Crack Initiation and Growth in Solder Joints Under Cyclic Shear Deformation Using Piezomechanical Actuation
S. Mark Spearing,
S. Mark Spearing
School of Engineering Sciences,
University of Southampton
, Highfield, Southampton SO17 1BJ, UK
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Qingda Yang
Qingda Yang
Department of Mechanical & Aerospace Engineering,
University of Miami
, P.O. Box 248194,Coral Gables, FL 33124
Search for other works by this author on:
Dong-Jin Shim
S. Mark Spearing
School of Engineering Sciences,
University of Southampton
, Highfield, Southampton SO17 1BJ, UK
Qingda Yang
Department of Mechanical & Aerospace Engineering,
University of Miami
, P.O. Box 248194,Coral Gables, FL 33124J. Eng. Mater. Technol. Jan 2007, 129(1): 19-28 (10 pages)
Published Online: December 6, 2005
Article history
Received:
December 10, 2004
Revised:
December 6, 2005
Citation
Shim, D., Spearing, S. M., and Yang, Q. (December 6, 2005). "Crack Initiation and Growth in Solder Joints Under Cyclic Shear Deformation Using Piezomechanical Actuation." ASME. J. Eng. Mater. Technol. January 2007; 129(1): 19–28. https://doi.org/10.1115/1.2400257
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