Creasing and offset printing are both examples of paperboard converting operations where the stress state is multiaxial, and where elastic-plastic deformation occurs in the thickness direction. Optimization of paperboard for such operations requires both advanced modeling and a better understanding of the mechanical behavior of the material. Today, our understanding and modeling of the out-of-plane properties are not as well established as our knowledge of the in-plane behavior. In order to bridge this gap, a modification of the Arcan device, which is well known in other fields, was developed for the experimental characterization of the out-of-plane mechanical behavior of paperboard. A fixture attached to the Arcan device was used to control the deformation in the test piece during loading. The test piece was glued to the device with a high viscosity adhesive and left stress-free during curing to achieve an initial state free of stresses. The apparatus proved to work well and to produce reliable results. Measurements of the mechanical behavior in combined normal and shear loading generated data points for the determination of the yield surface in the stress space. The elastic-plastic behavior in the thickness direction of paperboard was modeled assuming small-strain orthotropic linear elasticity and a quadratic yield function. Simulations using this yield function and an associative flow law showed good agreement with the test results.

Issue Section:
Technical Papers
Keywords:
stress-strain relations, tensile strength, elastoplasticity
Topics:
Failure, Paperboard, Shear (Mechanics), Stress, Deformation, Stress-strain curves
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Copyright © 2001
 by ASME
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