Microelectrochemical grinding (micro-ECG) is a variant of electrochemical grinding (ECG) process, in which material is removed by a combination of electrolytic dissolution and abrasive action that take place in a small interelectrode gap. This paper discusses analytical modeling of the material removal phenomenon in micro-ECG process to predict material removal rate. In the model, the phenomena, which contribute to the material removal in the process by electrolytic and abrasive actions, have been considered; these include streaming potential in the electrochemical action and shearing forces due to the flow of electrolyte through interelectrode gap and the abrasive action of grinding wheel. Two configurations of the process, viz., surface and cylindrical micro-ECG, have been modeled. The results have been validated by CFD simulation in the case of surface micro-ECG process, and specific experimentation in the case of cylindrical micro-ECG process.
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June 2008
Technical Briefs
Modeling of Material Removal Rate in Micro-ECG Process
Kishore S. Gaikwad,
Kishore S. Gaikwad
Department of Mechanical Engineering,
Indian Institute of Technology
, Bombay, Mumbai 400076, India
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Suhas S. Joshi
Suhas S. Joshi
Department of Mechanical Engineering,
e-mail: ssjoshi@iitb.ac.in
Indian Institute of Technology
, Bombay, Mumbai 400076, India
Search for other works by this author on:
Kishore S. Gaikwad
Department of Mechanical Engineering,
Indian Institute of Technology
, Bombay, Mumbai 400076, India
Suhas S. Joshi
Department of Mechanical Engineering,
Indian Institute of Technology
, Bombay, Mumbai 400076, Indiae-mail: ssjoshi@iitb.ac.in
J. Manuf. Sci. Eng. Jun 2008, 130(3): 034502 (7 pages)
Published Online: May 6, 2008
Article history
Received:
April 9, 2006
Revised:
January 10, 2008
Published:
May 6, 2008
Citation
Gaikwad, K. S., and Joshi, S. S. (May 6, 2008). "Modeling of Material Removal Rate in Micro-ECG Process." ASME. J. Manuf. Sci. Eng. June 2008; 130(3): 034502. https://doi.org/10.1115/1.2844587
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