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Keywords: thermal management
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. June 2024, 146(6): 061501.
Paper No: HT-23-1418
Published Online: March 15, 2024
...Ji Lang; Qianqian Wang; Shan Tong The heat source layout optimization (HSLO) is typically used to facilitate superior heat dissipation in thermal management. However, HSLO is characterized by numerous degrees-of-freedom and complex interrelations between components. Conventional optimization...
Journal Articles
Journal Articles
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2021, 143(10): 101501.
Paper No: HT-21-1514
Published Online: September 8, 2021
...Sevket U. Yuruker; Raphael K. Mandel; Patrick McCluskey; Michael M. Ohadi To improve the reliability and efficiency of power electronics, their thermal management must be further enhanced. Next-generation electronics systems are predicted to dissipate more heat as die size shrinks and power levels...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. March 2021, 143(3): 031501.
Paper No: HT-20-1115
Published Online: January 18, 2021
... and pressure drops. In general, as the temperature of the hotspot remains around 70 °C with a heat flux of 625 W/cm 2 , the nonuniform fin-enhanced microgaps appears to be a promising hotspot thermal management approach. The pressure drop of hydrofoil spanwise chip is highest among all the cases. DARPA...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. April 2020, 142(4): 041602.
Paper No: HT-18-1838
Published Online: February 27, 2020
... 12 01 2020 27 02 2020 polymer coating condensation heat transfer hydrophobic surface phase change thermal management The condensation process plays an important role in many industrial applications such as thermal management systems [ 1 – 3 ], defrost processes [ 4 ], power...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. October 2014, 136(10): 104503.
Paper No: HT-13-1474
Published Online: July 29, 2014
... for highest λ of the configuration returns the minimum value of θ at the optimal condition, which is a key engineering quantity that is sought in problems of this class. discrete heat source optimal configuration mixed convection surface radiation thermal management Discrete heat sources...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. January 2014, 136(1): 011301.
Paper No: HT-12-1374
Published Online: October 25, 2013
... and phase-change cooling strategies, this percentage becomes even greater. If the thermal management of an electronic device is inadequate, unacceptable temperature levels may be reached which can adversely affect device performance, reliability, and lifespan [ 7 ]. These thermal issues have spawned...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. January 2014, 136(1): 013001.
Paper No: HT-13-1378
Published Online: October 21, 2013
... , May 28–31, Orlando, FL, pp. 1255 – 1275 . [3] Sharma , R. K. , Bash , C. E. , Patel , C. D. , Friedrich , R. J. , and Chase , J. S. , 2005 , “ Balance of Power: Dynamic Thermal Management for Internet Data Centers ,” IEEE Internet Comput. , 9 ( 1 ), pp. 42 – 49 . 10.1109...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. August 2013, 135(8): 081902.
Paper No: HT-12-1384
Published Online: July 18, 2013
... to increase by up to 46%. As the cost of access to space is significant, this reduction in mass could lead to savings for spacecraft thermal management applications. extended surface heat transfer fin thermal radiation thermal management fractal The dissipation of waste heat is a critical...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. August 2013, 135(8): 082701.
Paper No: HT-12-1398
Published Online: July 18, 2013
... bifurcation angles. As expected, base temperatures were highest for the largest width-to-thickness ratios and smallest for materials with relatively higher thermal conductivities. thermal radiation fins computational thermal management extended surfaces heat transfer It is critically...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. May 2013, 135(5): 054503.
Paper No: HT-12-1231
Published Online: April 11, 2013
... electronics thermal management phase change material liquid metal heat storage electronic cooling Smartphone and PPC have emerged as extremely popular electronic mediums in the last two years with the iPhone and iPad in high demand and the Android Mobile Operating System gradually prevalent...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. April 2013, 135(4): 041901.
Paper No: HT-11-1177
Published Online: March 20, 2013
... enhancement, rendering it as an effective heat transfer enhancement scheme for single phase microchannel heat sink. enhanced microchannel oblique fins thermal management electronic cooling In the ceaseless search for higher performance with miniaturized electronic components, heat fluxes...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2012, 134(11): 112902.
Published Online: September 28, 2012
... Ortega. 23 09 2010 03 12 2011 flow boiling enhanced surface structured-porous subatmospheric pressure high heat flux water nucleation structured-porous surface screen laminate thermal management electronic cooling The rapidly increasing use of electronics...
Journal Articles
Publisher: ASME
Article Type: Heat Transfer Enhancement
J. Heat Mass Transfer. October 2012, 134(10): 101901.
Published Online: August 7, 2012
... 08 2012 enhanced microchannel oblique fins thermal management electronic cooling The miniaturization of electronic device coupled with advancement in packaging technology has led to continuous increments in packaging density and associated higher heat fluxes that need...
Journal Articles
Publisher: ASME
Article Type: Electronic Cooling
J. Heat Mass Transfer. June 2012, 134(6): 061401.
Published Online: May 2, 2012
...Man Prakash Gupta; Minki Cho; Saibal Mukhopadhyay; Satish Kumar In this paper, a proactive thermal management technique called “power multiplexing” is explored for many-core processors. Power multiplexing involves redistribution of the locations of active cores at regular time intervals to obtain...
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Heat Mass Transfer. November 2011, 133(11): 110801.
Published Online: September 2, 2011
...M. A. Ebadian; C. X. Lin In recent years, high-heat-flux cooling techniques have received great attention from researchers around the world due to its importance in thermal management of both commercial and defense high-power electronic devices. Although impressive progress has been made during...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 2011, 133(8): 081401.
Published Online: May 2, 2011
...Wessel W. Wits; Jim B. W. Kok A novel, integrated approach in thermal management of electronic products, based on two-phase cooling, is presented. A flat miniature heat pipe, integrated inside the laminated structure of a printed circuit board (PCB), has been developed, based on mainstream PCB...
Topics: Heat pipes, Heat