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Journal Articles

Thermal Analysis of Jet-in-Crossflow Technique for Hotspot Treatment in Electronics Cooling

Christian Corvera, Shadi Mahjoob
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. April 2024, 146(4): 042301.
Paper No: HT-23-1304
https://doi.org/10.1115/1.4064458
Published Online: January 29, 2024
View Article titled, Thermal Analysis of Jet-in-Crossflow Technique for Hotspot Treatment in Electronics Cooling
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Topics: Cooling, Temperature, Coolants, Computer cooling, Flow (Dynamics)
Journal Articles

Hydrothermal Performance Maximisation and Entropy Generation Minimisation of Different Perforated Pinned Heat Sink Designs for Electronic Cooling

Wissam H. Khalil, Itimad D. J. Azzawi, Amer Al-Damook, Fahad S. Alkasmoul
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. November 2022, 144(11): 114502.
Paper No: HT-22-1237
https://doi.org/10.1115/1.4055243
Published Online: September 8, 2022
View Article titled, Hydrothermal Performance Maximisation and Entropy Generation Minimisation of Different Perforated Pinned Heat Sink Designs for Electronic Cooling
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Topics: Entropy, Heat sinks, Computer cooling
Journal Articles

Thermal Analysis of Multijet Impingement Through Porous Media to Design a Confined Heat Management System

Carlos Zing, Shadi Mahjoob
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. August 2019, 141(8): 082203.
Paper No: HT-19-1067
https://doi.org/10.1115/1.4044008
Published Online: July 3, 2019
View Article titled, Thermal Analysis of Multijet Impingement Through Porous Media to Design a Confined Heat Management System
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Topics: Coolants, Cooling, Design, Flow (Dynamics), Fluids, Heat, Heat exchangers, Heat flux, Nanofluids, Porosity
Journal Articles

Nano-Phase Change Materials for Electronics Cooling Applications

Laura Colla, Davide Ercole, Laura Fedele, Simone Mancin, Oronzio Manca, Sergio Bobbo
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2017, 139(5): 052406.
Paper No: HT-16-1344
https://doi.org/10.1115/1.4036017
Published Online: March 7, 2017
View Article titled, Nano-Phase Change Materials for Electronics Cooling Applications
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Topics: Latent heat, Melting, Nanoparticles, Paraffin wax, Phase change materials, Temperature, Thermal conductivity, Waxes, Computer cooling, Heat
Journal Articles

High-Flux Thermal Management With Supercritical Fluids

Brian M. Fronk, Alexander S. Rattner
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. December 2016, 138(12): 124501.
Paper No: HT-15-1603
https://doi.org/10.1115/1.4034053
Published Online: August 2, 2016
View Article titled, High-Flux Thermal Management With Supercritical Fluids
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Topics: Computer cooling, Cooling, Fluids, Flux (Metallurgy), Heat, Heat flux, Heat sinks, Heat transfer, Microchannels, Supercritical fluids
Journal Articles

Optimizing a Functionally Graded Metal-Matrix Heat Sink Through Growth of a Constructal Tree of Convective Fins

Jacob Kephart, G. F. Jones
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. August 2016, 138(8): 082802.
Paper No: HT-15-1147
https://doi.org/10.1115/1.4033209
Published Online: April 26, 2016
View Article titled, Optimizing a Functionally Graded Metal-Matrix Heat Sink Through Growth of a Constructal Tree of Convective Fins
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Topics: Convection, Fins, Flow (Dynamics), Heat sinks, Heat transfer, Metals, Optimization, Porosity, Shapes, Geometry
Journal Articles

Effects of High Frequency Droplet Train Impingement on Crown Propagation Dynamics and Heat Transfer

J. P. Muthusamy, Taolue Zhang, Jorge Alvarado, Anoop Kanjirakat, Reza Sadr
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Photo Gallery
J. Heat Mass Transfer. February 2016, 138(2): 020903.
Paper No: HT-15-1700
https://doi.org/10.1115/1.4032231
Published Online: January 18, 2016
View Article titled, Effects of High Frequency Droplet Train Impingement on Crown Propagation Dynamics and Heat Transfer
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Topics: Drops, Dynamics (Mechanics), Heat transfer, Trains, Computer simulation, Temperature, Computational fluid dynamics, Computer cooling, Cooling, Generators
Journal Articles

Foreword

Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Foreword
J. Heat Mass Transfer. November 2013, 135(11): 110501.
Paper No: HT-13-1142
https://doi.org/10.1115/1.4024626
Published Online: September 23, 2013
View Article titled, Foreword
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Topics: Computer cooling, Cooling, Cutting, Electronics, Engineering teachers, Heat flux, Heat transfer, Momentum, Thermal systems, Transport processes
Journal Articles

Enhanced Pool Boiling With Ethanol at Subatmospheric Pressures for Electronics Cooling

Ankit Kalani, Satish G. Kandlikar
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2013, 135(11): 111002.
Paper No: HT-12-1142
https://doi.org/10.1115/1.4024595
Published Online: September 23, 2013
View Article titled, Enhanced Pool Boiling With Ethanol at Subatmospheric Pressures for Electronics Cooling
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Topics: Boiling, Ethanol, Heat flux, Microchannels, Pool boiling, Pressure, Temperature, Computer cooling, Heat transfer, Copper
Journal Articles

Steady and Unsteady Air Impingement Heat Transfer for Electronics Cooling Applications

Mehmet Arik, Rajdeep Sharma, Jason Lustbader, Xin He
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2013, 135(11): 111009.
Paper No: HT-12-1188
https://doi.org/10.1115/1.4024614
Published Online: September 23, 2013
View Article titled, Steady and Unsteady Air Impingement Heat Transfer for Electronics Cooling Applications
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Topics: Heat transfer, Jets, Reynolds number, Computer cooling, Temperature
Journal Articles

Investigation of Hierarchically Branched-Microchannel Coolers Fabricated by Deep Reactive Ion Etching for Electronics Cooling Applications

J. P. Calame, D. Park, R. Bass, R. E. Myers, P. N. Safier
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 2009, 131(5): 051401.
https://doi.org/10.1115/1.3001017
Published Online: March 20, 2009
View Article titled, Investigation of Hierarchically Branched-Microchannel Coolers Fabricated by Deep Reactive Ion Etching for Electronics Cooling Applications
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Topics: Coolers, Heat, Heat transfer coefficients, Microchannels, Silicon, Simulation, Temperature, Gallium nitride, Flow (Dynamics), Heat flux
Journal Articles

Novel Design of a Miniature Loop Heat Pipe Evaporator for Electronic Cooling

Randeep Singh, Aliakbar Akbarzadeh, Chris Dixon, Masataka Mochizuki
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. October 2007, 129(10): 1445–1452.
https://doi.org/10.1115/1.2754945
Published Online: February 9, 2007
View Article titled, Novel Design of a Miniature Loop Heat Pipe Evaporator for Electronic Cooling
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Topics: Computer cooling, Condensers (steam plant), Cooling, Design, Fluids, Heat, Heat pipes, Stress, Temperature, Thermal resistance
Journal Articles

The Electro-Adsorption Chiller: Performance Rating of a Novel Miniaturized Cooling Cycle for Electronics Cooling

K. C. Ng, M. A. Sai, A. Chakraborty, B. B. Saha, S. Koyama
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. September 2006, 128(9): 889–896.
https://doi.org/10.1115/1.2241786
Published Online: February 7, 2006
View Article titled, The Electro-Adsorption Chiller: Performance Rating of a Novel Miniaturized Cooling Cycle for Electronics Cooling
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Topics: Cooling, Cycles, Temperature, Water, Computer cooling, Copper, Condensers (steam plant), Heat, Refrigerants
Journal Articles

Foreword

Cristina Amon, Dereje Agonafer
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Article
J. Heat Mass Transfer. January 2005, 127(1): 1.
https://doi.org/10.1115/1.1862670
Published Online: February 15, 2005
View Article titled, Foreword
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Topics: Cooling, Heat conduction, Heat sinks, Heat transfer, Packaging, Thermal management, Computers, Computer cooling, Inventions, Design
Journal Articles

Optimized Heat Transfer for High Power Electronic Cooling Using Arrays of Microjets

Matteo Fabbri, Vijay K. Dhir
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. July 2005, 127(7): 760–769.
https://doi.org/10.1115/1.1924624
Published Online: November 23, 2004
View Article titled, Optimized Heat Transfer for High Power Electronic Cooling Using Arrays of Microjets
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Topics: Heat transfer, Jets, Temperature, Cooling, Computer cooling, Water
Journal Articles

Effects of Dissolved Gas Content on Pool Boiling of a Highly Wetting Fluid

S. M. You, T. W. Simon, A. Bar-Cohen, Y. S. Hong
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1995, 117(3): 687–692.
https://doi.org/10.1115/1.2822631
Published Online: August 1, 1995
View Article titled, Effects of Dissolved Gas Content on Pool Boiling of a Highly Wetting Fluid
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Topics: Boiling, Fluids, Pool boiling, Wetting, Computer cooling, Heat transfer, Cylinders, Electronic equipment, Heat flux, Heating
Journal Articles

Direct Air Cooling of Electronic Components: Reducing Component Temperatures by Controlled Thermal Mixing

A. M. Anderson, R. J. Moffat
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1991, 113(1): 56–62.
https://doi.org/10.1115/1.2910551
Published Online: February 1, 1991
View Article titled, Direct Air Cooling of Electronic Components: Reducing Component Temperatures by Controlled Thermal Mixing
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Topics: Cooling, Electronic components, Forced convection, Temperature, Fluids, Heating, Pressure drop, Computer cooling, Coolants, Electronic equipment
Journal Articles

Applying Heat Transfer Coefficient Data to Electronics Cooling

R. J. Moffat, A. M. Anderson
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 1990, 112(4): 882–890.
https://doi.org/10.1115/1.2910495
Published Online: November 1, 1990
View Article titled, Applying Heat Transfer Coefficient Data to Electronics Cooling
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Topics: Computer cooling, Heat transfer coefficients, Temperature, Databases, Heat, Cooling, Cooling systems, Design, Discrete systems, Electronic equipment