The transient calorimetric technique was used to measure the total hemispherical emissivity of conductive materials. The emissivity was measured in a small central region of a thin strip heated electrically in a vacuum chamber. The axial heat transfer along the sample and the heat losses from the wires were considered in the transient heat transfer calculations. An appropriate time interval for the hot sample cooling rate is needed to improve the emissivity solution accuracy. Two ways were used to analyze the data, based on the known specific heat and the assumed functions of the emissivity and the specific heat. Comparisons with steady-state data showed that their results are very similar with a maximum difference of only 13% (944 K). Therefore, the transient method based on the function assumption is a good choice for measurements when there are inaccurate or insufficient specific heat data at the desired temperatures. Since ferromagnetic materials have Curie points at higher temperatures, this study also investigated the applicability of the transient calorimetric technique for high temperature emissivity measurements. For higher temperatures above the Curie point, the steady-state method is more accurate than the transient method. These analyses provide a comprehensive understanding of the transient method for measuring the total hemispherical emissivity.
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November 2012
This article was originally published in
Journal of Heat Transfer
Research-Article
Transient Calorimetric Measurement Method for Total Hemispherical Emissivity
Tairan Fu,
Tairan Fu
1
Key Laboratory for Thermal Science and Power Engineering of Ministry of Education,
Department of Thermal Engineering,
e-mail: trfu@mail.tsinghua.edu.cn
Department of Thermal Engineering,
Tsinghua University
,Beijing 100084
, P. R. China
;Beijing Key Laboratory of CO2 Utilization and Reduction Technology
,Beijing 100084
, P. R. China
e-mail: trfu@mail.tsinghua.edu.cn
1Corresponding author.
Search for other works by this author on:
Peng Tan
Peng Tan
Key Laboratory for Thermal Science and Power Engineering of Ministry of Education,
Department of Thermal Engineering,
Department of Thermal Engineering,
Tsinghua University
,Beijing 100084
, P. R. China
Search for other works by this author on:
Tairan Fu
Key Laboratory for Thermal Science and Power Engineering of Ministry of Education,
Department of Thermal Engineering,
e-mail: trfu@mail.tsinghua.edu.cn
Department of Thermal Engineering,
Tsinghua University
,Beijing 100084
, P. R. China
;Beijing Key Laboratory of CO2 Utilization and Reduction Technology
,Beijing 100084
, P. R. China
e-mail: trfu@mail.tsinghua.edu.cn
Peng Tan
Key Laboratory for Thermal Science and Power Engineering of Ministry of Education,
Department of Thermal Engineering,
Department of Thermal Engineering,
Tsinghua University
,Beijing 100084
, P. R. China
1Corresponding author.
Contributed by the Heat Transfer Division of ASME for publication in the JOURNALOF HEAT TRANSFER. Manuscript received May 25, 2011; final manuscript received May 15, 2012; published online September 24, 2012. Assoc. Editor: He-Ping Tan.
J. Heat Transfer. Nov 2012, 134(11): 111601 (7 pages)
Published Online: September 24, 2012
Article history
Received:
May 25, 2011
Revision Received:
May 15, 2012
Citation
Fu, T., and Tan, P. (September 24, 2012). "Transient Calorimetric Measurement Method for Total Hemispherical Emissivity." ASME. J. Heat Transfer. November 2012; 134(11): 111601. https://doi.org/10.1115/1.4006896
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