Experimental studies are presented to show the effect of thermal stresses on thermal contact conductance (TCC) at low contact pressures. It is observed that in a closed contact assembly, contact pressure acting on the interface changes with the changing temperature of contact members. This change in contact pressure consequently causes variations in the TCC of the junction. A relationship between temperature change and the corresponding magnitude of developed thermal stress in a contact assembly is determined experimentally. Inclusion of a term called temperature dependent load correction factor is suggested in the theoretical model for TCC to make it capable of predicting TCC values more accurately in contact assemblies that experience large temperature fluctuations.

Issue Section:
Technical Briefs
Keywords:
heat conduction, stress effects, thermal conductivity, thermal stresses, OFHC Cu, thermal contact conductance, thermal stress, load correction factor
Topics:
Contact resistance, Stress, Temperature, Thermal stresses, Pressure, Manufacturing
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