This paper discusses the importance of developing cooling solutions for low profile devices. This is addressed with an experimental and theoretical study on forced convection cooling solution designs that could be implemented into such devices. Conventional finned and corresponding finless designs of equal exterior dimensions are considered for three different heat sink profiles ranging from 1 mm to 4 mm in combination with a commercially available radial blower. The results show that forced convection heat transfer rates can be enhanced by up to 55% using finless designs at low profiles with relatively small footprint areas. Overall, this paper provides optimization and geometry selection criteria, which are relevant to designers of low profile cooling solutions.
Issue Section:
Electronic Cooling
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.Copyright © 2010
by American Society of Mechanical Engineers
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