This paper employs continuum principles combined with van der Waals theory to estimate the thermal contact resistance between nanowires and planar substrates. This resistance is modeled using elastic deformation theory and thermal resistance relations. The contact force between a nanowire and substrate is obtained through a calculation of the van der Waals interaction energy between the two. The model estimates numerical values of constriction and gap resistances for several nanowire-substrate combinations with water and air as the surrounding media. The total interface resistance is almost equal to the gap resistance when the surrounding medium has a high thermal conductivity. For a low-conductivity medium, the interface resistance is dominated by the constriction resistance, which itself depends significantly on nanowire and substrate conductivities. A trend observed in all calculations is that the interface resistance increases with smaller nanowires, showing that interface resistance will be a significant parameter in the design and performance of nanoelectronic devices.

Issue Section:
Technical Briefs
Keywords:
Thermal Contact Resistance, Nanowire, Constriction, van der Waals Force, nanowires, thermal resistance, contact resistance, continuum mechanics, van der Waals forces, elastic deformation, thermal conductivity, electrical contacts
Topics:
Nanowires, Van der Waals forces, Thermal resistance, Contact resistance, Thermal conductivity, Water
1.
Javey
,
A.
,
Guo
,
J.
,
Wang
,
Q.
,
Lundstrom
,
M.
, and
Dai
,
H.
,
2003
, “
Ballistic Carbon Nanotube Field Effect Transistors
,”
Nature (London)
,
424
, pp.
654
–
657
.
2.
Avouris
,
P.
,
Appenzeller
,
J.
,
Martel
,
J.
, and
Wind
,
S. J.
,
2003
, “
Carbon Nanotube Electronics
,”
Proc. IEEE
,
91
(
11
), pp.
1772
–
1784
.
3.
Cui
,
Y.
,
Zhong
,
Z.
,
Wang
,
D.
,
Wang
,
W. U.
, and
Lieber
,
C. M.
,
2003
, “
High Performance Silicon Nanowire Field Effect Transistors
,”
Nano Lett.
,
3
(
2
), pp.
149
–
152
.
4.
Lundstrom, M., 2000, Fundamentals of Carrier Transport, Cambridge University Press, Cambridge, England, Chap. 2.
5.
Cahill
,
D. G.
,
Ford
,
W. K.
,
Goodson
,
K. E.
,
Mahan
,
G. D.
,
Majumdar
,
A.
,
Maris
,
H. J.
,
Merlin
,
R.
, and
Phillpot
,
S. R.
,
2003
, “
Nanoscale Thermal Transport
,”
J. Appl. Phys.
,
93
(
2
), pp.
793
–
818
.
6.
Li
,
D.
,
Wu
,
Y.
,
Kim
,
P.
,
Shi
,
L.
,
Yang
,
P.
, and
Majumdar
,
A.
,
2003
, “
Thermal Conductivity of Individual Silicon Nanowires
,”
Appl. Phys. Lett.
,
83
(
14
), pp.
2934
–
2936
.
7.
Mingo
,
N.
, and
Yang
,
L.
,
2003
, “
Phonon Transport in Nanowires Coated With an Amorphous Material: An Atomistic Green’s Function Approach
,”
Phys. Rev. B
,
68
,
245406
245406
.
8.
Pickett
,
W. E.
,
Feldman
,
J. L.
, and
Deppe
,
J.
,
1996
, “
Thermal Transport Across Boundaries in Diamond Structure Materials
,”
Modell. Simul. Mater. Sci. Eng.
,
4
(
4
), pp.
409
–
419
.
9.
Israelachvili, J. N., 1985, Intermolecular and surface forces with applications to colloidal and biological systems, Academic Press, London.
10.
McGee
,
G. E.
,
Schankula
,
M. H.
, and
Yovanovich
,
M. M.
,
1985
, “
Thermal Resistance of Cylinder-Flat Contacts: Theoretical Analysis and Experimental Verification of a Line Contact Model
,”
Nucl. Eng. Des.
,
86
, pp.
369
–
381
.
11.
Montgomery
,
S. W.
,
Franchek
,
M. A.
, and
Goldschmidt
,
V. W.
,
2000
, “
Analytical Dispersion Force Calculations for Nontraditional Geometries
,”
J. Colloid Interface Sci.
,
227
, pp.
567
–
584
.
12.
Huxtable
,
S. T.
, and
Cahill
,
D. G.
,
2004
, “
Thermal Contact Conductance of Adhered Microcantilevers
,”
J. Appl. Phys.
,
95
(
4
), pp.
2102
–
2108
.
13.
Huxtable
,
S. T.
,
Cahill
,
D. G.
,
Shenogin
,
S.
,
Xue
,
L.
,
Ozisik
,
R.
,
Barone
,
P.
,
Usrey
,
P.
,
Strano
,
M. S.
,
Siddons
,
G.
,
Shim
,
M.
, and
Keblinski
,
P.
,
2003
, “
Interfacial Heat Flow in Carbon Nanotube Suspensions
,”
Nat. Mater.
,
2
(
11
), pp.
731
–
734
.
14.
Volz
,
S. G.
, and
Chen
,
G.
,
1999
, “
Molecular Dynamics Simulation of Thermal Conductivity of Silicon Nanowires
,”
Appl. Phys. Lett.
,
75
(
14
), pp.
2056
–
2058
.
15.
Maruyama
,
S.
, and
Kimura
,
T.
,
1999
, “
A Study on Thermal Resistance Over a Solid-Liquid Interface by the Molecular Dynamics Method
,”
Therm. Sci. Eng.
,
7
(
1
), pp.
63
–
69
.
16.
Bondi
,
A.
,
1964
, “
van der Waals Volumes and Radii
,”
J. Phys. Chem.
,
68
(
3
), pp.
441
–
451
.
17.
Visser
,
J.
,
1989
, “
van der Waals and Other Cohesive Forces Affecting Powder Fluidization
,”
Powder Technol.
,
58
, pp.
1
–
10
.
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