Experiments were conducted to study the effects of micro-pin-fins and submicron-scale roughness on the boiling heat transfer from a silicon chip immersed in a pool of degassed and gas-dissolved FC-72. Square pin-fins with fin dimensions of 50×50×60μm3 (width×thickness×height) and submicron-scale roughness (RMS roughness of 25 to 32 nm) were fabricated on the surface of square silicon chip 10×10×0.5mm3 by use of microelectronic fabrication techniques. Experiments were conducted at the liquid subcoolings of 0, 3, 25, and 45 K. Both the micro-pin-finned chip and the chip with submicron-scale roughness showed a considerable heat transfer enhancement as compared to a smooth chip in the nucleate boiling region. The chip with submicron-scale roughness showed a higher heat transfer performance than the micro-pin-finned chip in the low-heat-flux region. The micro-pin-finned chip showed a steep increase in the heat flux with increasing wall superheat. This chip showed a higher heat transfer performance than the chip with submicron-scale roughness in the high-heat-flux region. The micro-pin-finned chip with submicron-scale roughness on it showed the highest heat transfer performance in the high-heat-flux region. While the wall superheat at boiling incipience was strongly dependent on the dissolved gas content, it was little affected by the liquid subcooling.

Issue Section:
Technical Papers
Keywords:
boiling, organic compounds, cooling, heat transfer, rough surfaces, monolithic integrated circuits, integrated circuit packaging, Boiling, Devices, Enhancement, Finned Surfaces, Heat Transfer, Roughness
Topics:
Boiling, Fins, Surface roughness, Heat transfer, Silicon chips
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