You do not currently have access to this content.
Skip Nav Destination
Article navigation
November 1988
This article was originally published in
Journal of Heat Transfer
Technical Briefs
Evaluation of Thermal Contact Conductance Between Mold Compound and Heat Spreader Materials
G. P. Peterson,
G. P. Peterson
Mechanical Engineering Department, Texas A&M University, College Station, TX 77843
Search for other works by this author on:
L. S. Fletcher
L. S. Fletcher
Mechanical Engineering Department, Texas A&M University, College Station, TX 77843
Search for other works by this author on:
G. P. Peterson
Mechanical Engineering Department, Texas A&M University, College Station, TX 77843
L. S. Fletcher
Mechanical Engineering Department, Texas A&M University, College Station, TX 77843
J. Heat Transfer. Nov 1988, 110(4a): 996-999 (4 pages)
Published Online: November 1, 1988
Article history
Received:
April 27, 1987
Online:
October 20, 2009
Citation
Peterson, G. P., and Fletcher, L. S. (November 1, 1988). "Evaluation of Thermal Contact Conductance Between Mold Compound and Heat Spreader Materials." ASME. J. Heat Transfer. November 1988; 110(4a): 996–999. https://doi.org/10.1115/1.3250605
Download citation file:
Get Email Alerts
Cited By
Entropic Analysis of the Maximum Output Power of Thermoradiative Cells
J. Heat Mass Transfer
Molecular Dynamics Simulations in Nanoscale Heat Transfer: A Mini Review
J. Heat Mass Transfer
Related Articles
The Thermal Contact Conductance of Hard and Soft Coat Anodized Aluminum
J. Heat Transfer (May,1995)
A Note on the Evaluation of Thermal Constriction Resistance for Finite Thickness Gaps
J. Heat Transfer (February,1997)
Elastoplastic Constriction Resistance Model for Sphere-Flat Contacts
J. Heat Transfer (February,1996)
Thermal Gap Conductance of Conforming Surfaces in Contact
J. Heat Transfer (August,1993)
Related Proceedings Papers
Related Chapters
Radiation
Thermal Management of Microelectronic Equipment
Radiation
Thermal Management of Microelectronic Equipment, Second Edition
How to Use this Book
Thermal Spreading and Contact Resistance: Fundamentals and Applications