...-copper system with a gold-tin solder bond layer. The results obtained are likely to be useful in interfacial stress evaluation and physical design of bimaterial assemblies used in microelectronics and photonics applications. Consider a plate of unit thickness subjected to unit shear stress...

... 24 02 2010 24 09 2010 03 12 2010 03 12 2010 chip-on-board packaging contact resistance gold lead bonding tape automated bonding thin films tin In the past two decades, liquid crystal displays (LCDs) have a big market share in the industry of flat panel display...

... combined with the no-flow underfill material curing on underfill voiding during assembly process. Figure 5 presented two micrographs of voids formed during the reflow process in TV-1 and TV-2, respectively. TV-1, consisting of a glass cover slide on the underfill deposited substrate without lead-tin...

...Ming-Hwa R. Jen; Lee-Cheng Liu; Jenq-Dah Wu The work is aimed to investigate the mechanical responses of bare dies of the combination of pure tin ∕ Al – Ni V – Cu Under bump metallization (UBM) and packages of pure tin ∕ Al – Ni V – Cu UBM/substrate of standard thickness of aurum. The mechanical...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received March 2003; final revision, September 2003. Associate Editor: E. Lorenzini. 01 March 2003 01 September 2003 30 04 2004 tin lead solders elastic constants fatigue viscoplasticity Newton-Raphson method numerical analysis...

...John H. Lau; Stephen H. Pan In this study, a three-dimensional (3D) nonlinear stress analysis of the tin whisker initiation on a pure matte Sn-plated copper substrate is investigated. The structure is subjected to a compressive stress acting at the Sn layer which is generated by the spontaneous...