... semiconductor device packaging silicon stress effects residual stress piezoresistive gauge nMOSFET DC characteristics electron-mobility A semiconductor device is sometimes subjected to high residual stress during the packaging (resin-molding) process. This is due to the large mismatch...

... technology finite elements stress analysis micromechanics elastic moduli finite element analysis gold integrated circuit bonding integrated circuit interconnections stress effects ultrasonic bonding 12 07 2008 16 09 2009 29 10 2009 2009 American Society of Mechanical...

... is presented in the next section. Creep in the biaxial stress condition still needs further investigation. The axial stress effects on the shearing deformation behavior of the Pb-free SAC 387 and Sn – Pb eutectic alloys at shearing strain rates of 1.3...

... packaging life testing solders electronics packaging cracks stress effects finite element analysis There are many types of thermal fatigue models for determining the solder joint reliability of electronic packages, each with its own merits 1 . These models are dependent on package-level...

...Bernd Michel,, Guest Editor, Poly’2000 Co-chair; Kikuo Kishimoto,, Guest Editor, Poly’2000 Co-chair 12 12 2002 reliability polymers adhesion adhesives plastic packaging integrated circuit packaging fracture mechanics stress effects thermal management (packaging...

... PACKAGING . Manuscript received by the EPPD December 21, 2001. 21 December 2001 26 07 2002 lead alloys tin alloys soldering creep grain size fatigue stress effects In previous work, PART I of this work 1 , a micromechanics approach to cyclic creep-fatigue damage in Pb-Sn...

... received December 12, 1999. Associate Technical Editor: M. Shiratori. 08 November 1999 12 December 1999 packaging thermal stresses delamination cracks stress effects thermal management (packaging) The interfacial stresses are shown in Figs. 2 ( a ) 3 4 ( b...