... bronze heat transfer microchannel flow nitrogen silicon compounds slip flow thermal conductivity thermal management (packaging) conjugate uniform heat flux gas slip flow long microchannel Microchannel flows have drawn wide attention over the past decade due to the growing interest...

... compared with the previous two methods while providing much higher efficiency, acceptable CRI, and lifetime ( 5 7 ). light emitting diode correlated color temperature color-rendering index total internal reflection lumens electronics packaging light emitting diodes phosphors silicon...

... state, and immediately following annealing. The metallization remained stable following subjection to a temperature of 400 ° C for 100 h in air. diffusion barriers electron spectroscopy electronics packaging metallisation silicon compounds thermal conductivity thermal expansion tungsten...

... percentage. 22 12 2007 26 09 2008 13 02 2009 electronics packaging finite element analysis shrinkage silicon compounds epoxy molding compound FEA bimaterial model thermal expansion coefficient chemical cure shrinkage silica filler percentage Owing to its low cost...

... electronics packaging fatigue testing flip-chip devices life testing nanostructured materials passivation reliability silicon compounds thermal shock thermomechanical treatment Underfill materials are used in flip chip assemblies to enhance the thermomechanical reliability of the solder bumps...

... encapsulation filled polymers particle size permittivity sieving silicon compounds thermal conductivity thermal conductivity polymer composite ceramic filler dielectric properties Thermally conductive but electrically insulating, also for their cost effectiveness and design flexibility...

... nanoparticles soldering assembling fine-pitch technology fatigue testing mechanical testing delamination fatigue cracks fracture passivation silicon compounds To enhance solder bump reliability in flip chips on organic substrates, an epoxy-based underfill is often dispensed along the sides...

... of the package. Package reliability can be improved by the application of an underfill. In this paper, we report the development of novel underfill materials utilizing nano-filler technology, which provides a previously unobtainable balance of low CTE and good solder joint formation. silicon compounds flip...

... at 60 °C for 1 h. Then, Teflon tubes were pulled out and PDMS was peeled off. PDMS film adheres on the Pyrex substrate to encapsulate the fabricated microchannel. 03 09 2003 09 08 2004 silicon compounds alumina microfluidics micromachining channel flow electrophoresis...

... of the elastic interaction between the particles and the matrix as well. Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EEPD January 11, 2000. 11 January 2000 silicon compounds filled...