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Keywords: polishing
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 110–114.
Published Online: April 30, 2004
... was determined predominantly by the geometry and scratch tip sharpness of a few large and deep scratches formed during wafer thinning. Although additional polishing by dry-polishing technique after traditional mechanical coarse/fine grinding could greatly improve the average roughness of the die surface...