... improvement of heat dissipation in comparison with the neat polymer matrix [( 2 3 )]. Recently, carbon-based nanostructured materials such as carbon black, high aspect ratio 1D carbon nanotubes (CNTs), and 2D graphite nanoplatelets (GNPs) have been proposed as fillers in TIM matrices [( 1 4 5 6 7 8 9...

... electronics packaging fatigue testing flip-chip devices life testing nanostructured materials passivation reliability silicon compounds thermal shock thermomechanical treatment Underfill materials are used in flip chip assemblies to enhance the thermomechanical reliability of the solder bumps...

.... T. Read. 20 August 1999 23 July 2001 26 07 2002 diamond CVD coatings adhesion fracture toughness elemental semiconductors semiconductor thin films nanostructured materials Synthetic polycrystalline diamond films produced by chemical vapor deposition (CVD...

... manuscript received January 12, 2001. Associate Editor: G. De Mey. 29 June 1999 12 January 2001 filled polymers nanostructured materials capacitors multichip modules materials preparation electron device manufacture Passive components such as resistors, capacitors...